Mouser Electronics, Inc. now offers the new GaNEXUS™ gallium nitride field-effect transistors (GaN FETs) from onsemi. GaNEXUS GaN FETs utilize the wide bandwidth of GaN to deliver features such as fast switching, reduced output and gate loading, and improved efficiency for applications in AI, data centers, robotics, industrial automation, and energy infrastructure.
In the design of galvanically isolated communication and signal acquisition circuits for industrial applications, most engineers still rely on solutions based on discrete components: an RS-485/CAN bus transceiver, a digital isolator, and a separate isolated power supply module.
The demand for low-voltage clock drivers continues to grow due to the rapid adoption of advanced FinFET process nodes used in high-performance FPGAs and SoCs, AI accelerators, and next-generation CPUs. Printed circuit board designers face increasing challenges due to the limited availability of standard 1.2V LVCMOS clock buffers and level-conversion buffers capable of reducing high-voltage clock signals to the lower voltage levels required by these advanced devices.
Microchip Technology and Marelli announce a new solution that allows the transmission of graphics and video content generated by the vehicle's central computer directly to the car's displays via ASA Motion Link (ASA-ML), an open standard for automotive video connectivity.
Nanopower Semiconductor has announced the nPZ2100, the latest addition to its nPZero™ power-saving integrated circuit (PSIC) platform. Based on the nPZero architecture, the nPZ2100 enables sensor systems with limited battery life to operate with an ultra-low-power complementary integrated circuit
Nuvoton Technology has announced that it will begin mass production in September of the KA49703A and KA49713A battery monitoring integrated circuits (BMICs), optimized for battery backup units (BBU(*1)) used in AI servers.
Mouser Electronics, Inc. offers MediaTek's Genio 420 IoT platform, a solution designed for embedded devices that need to combine processing power, connectivity, and artificial intelligence (AI) and generative AI (GenAI) capabilities directly on the device. The Genio 420 is geared toward edge computing applications, where running inference locally reduces latency and decreases reliance on cloud processing services.
ROHM has developed a second-generation terahertz (THz) oscillation device that utilizes semiconductor elements known as resonant tunnel diodes (RTDs). ROHM makes this device available through the RTD-EVK-G2 terahertz device evaluation kit, which includes a sample device, a cable, and an evaluation board.
Renesas Electronics Corporation has announced its third-generation (Gen 3) chipset solutions for DDR5 Multiplexed Rank Dual In-Line (MRDIMM) memory modules, delivering server-class DDR5 MRDIMM speeds of up to 16,000 megatransfers per second (MT/s). The new solutions are designed to meet the growing demand for higher memory bandwidth driven by artificial intelligence (AI) data centers, cloud infrastructure, and accelerated computing workloads.
As AI models grow larger and computing workloads demand greater volumes of data, system architects face increasing challenges in delivering higher memory bandwidth without sacrificing compatibility with existing server platforms. Renesas' third-generation MRDIMM solutions offer 25% higher memory bandwidth than their second-generation solutions while still utilizing existing DDR5 infrastructure. As a result, server platforms can achieve higher performance without disruptive architectural changes.
Renesas continues to offer a field-proven, production-ready MRDIMM platform encompassing MRCDs, MDBs, power management integrated circuits (PMICs), serial presence detection concentrators (SPDs), and temperature sensors. This platform approach enables customers to scale MRDIMM performance across generations while maintaining design continuity and accelerating deployment.
MRDIMM Gen 3 builds upon the proven MRDIMM architecture introduced with Gen 2, expanding performance while maintaining standard DIMM form factors and system compatibility. Gen 3 also introduces improvements in system visibility and robustness, including a quality indication status for the Device Equalization Self-Training Mode (DESTM), which allows users to fine-tune receiver timing and EQ training to maximize headroom.
In addition to performance improvements, Renesas' Gen 3 MRDIMM solutions have been designed with system-level energy efficiency in mind, helping customers balance increasing bandwidth requirements with system-level thermal and power consumption constraints. Detailed power consumption comparisons will be provided in the accompanying product documentation.
“AMD has a long history of supporting open, standards-based technologies that drive innovation in data centers and provide greater flexibility as AI and HPC workloads continue to evolve,” said Amit Goel, corporate vice president of Enterprise AI and Compute Platform Solutions Engineering at AMD. “Innovations in next-generation memory formats, such as MRDIMM and the Renesas chipset, are important in helping the industry deliver higher bandwidth, greater efficiency, and continuous platform scalability.”
“AI training and inference workloads are fundamentally redefining system memory requirements for data center infrastructure,” said Sameer Kuppahalli, vice president and general manager of the Memory Interfaces Division at Renesas. “To meet the insatiable demands of these workloads for memory capacity and performance, Renesas continues to lead the industry with the launch of our 3rd generation of chipset components for MRDIMMs.” Our customers use the full suite of Renesas chipset components to continue pushing the boundaries of memory performance and capacity."
Mouser Electronics, Inc. now has the STMicroelectronics ASM330LHHG1 6-axis inertial measurement unit (IMU) in stock. The ASM330LHHG1 sensor features a 3-axis digital gyroscope and a 3-axis digital accelerometer, and operates over an extended temperature range of -40 to +125 °C.
GigaDevice has announced the launch of its new GD24CL series of I²C EEPROM memories. This new family offers outstanding performance, comprehensive security protection mechanisms, and excellent reliability, meeting the demanding requirements for stable, long-term storage of critical configuration data.
Toshiba Electronics Europe GmbH (“Toshiba”) introduces the TDS5B212MX and TDS5C212MX, high-speed differential signal multiplexer (MUX) and demultiplexer (DEMUX) switches. Suitable for servers, industrial test equipment, robots, and related applications, the new products support high-speed interfaces such as PCIe® 6.0 and USB4® version 2.0.
Analog Devices, Inc. has announced that its A²B 2.0 (Automotive Audio Bus) is now production-ready. As the next evolution of ADI's A²B technology, A²B 2.0 is designed to help original equipment manufacturers (OEMs) and Tier 1 suppliers in the automotive industry...
Maxim Integrated Products, Inc. has introduced the MAX98396 Class D/G speaker amplifier, boasting the industry's lowest noise and lowest standby power consumption. The 20V digital input audio power amplifier delivers 12.7mW of standby power to meet and exceed...
Melexis expands its range of magnetic sensing integrated circuits (ICs) with a dual-mold package (DMP) variant of the MLX90425. This new device, which maintains package consistency with the established MLX90364 and MLX90421 ICs,
At PCIM in Nuremberg, from May 10-12, 2016, ROHM Semiconductor will present its latest power supply innovations for high-speed switching and high-power performance, while also meeting the need for greater energy savings...
Mitsubishi Electric has introduced its sixth generation of MPD (Mega Power Dual) IGBT modules. These modules, designed for use in power converters such as large-capacity photovoltaic and wind power generation systems, are also suitable for other high-power applications...
Smart factories worldwide are leveraging advanced automation applications such as augmented reality, autonomous mobile robots, cobots, and industrial sensors. Even beyond the traditional production floor, automation is accelerating in environments such as...
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