to provide a narrow-pitch 3D circuitry integrated into a single molded package suitable for high-density medical devices, while meeting the demanding requirements of the healthcare sector.
To expand functionality, save space, and reduce weight and costs, 3D MID/LDS technology combines the versatility of the two-shot MID molding process with the speed and precision of LDS. Scalable from small production runs to mass production, LDS uses a 3D laser to map microline electronic circuitry onto a variety of RoHS-compliant molded plastics, enabling pattern modifications with lines and gaps as small as 0.10 mm and circuitry pitches as low as 0.35 mm.
The MediSpec MID/LDS 3D package is suitable for blood glucose meters, home patient monitoring, catheter interfaces, pulse oximetry sensors, hearing aids, and many other medical devices. In addition to comprehensive technical support, Molex quality controls MID/LDS through rigorous testing to ensure product reliability and compliance with performance criteria.
