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TE Connectivity's RayFlite RFHVE high-voltage power cables are now available through Mouser Electronics. This product line is designed for power wiring in electric and battery-powered hybrid aircraft, where electrical systems require conductors capable of operating at high voltages and under the specific environmental conditions typical of aerospace applications.
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Feasycom, Mecter SL's representative in Spain and Portugal, offers various solutions for developing Bluetooth-enabled devices, from Bluetooth Classic modules for serial transmission to Bluetooth Low Energy (BLE) platforms based on Nordic Semiconductor SoCs.
One such solution is the new FSC HC05, a highly integrated Bluetooth BR/EDR v3.0 module designed to incorporate wireless connectivity into a wide range of electronic equipment.
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Same Sky® and its Audio division have announced the launch of test boxes for speaker prototyping. These boxes, which initially accommodate miniature rectangular speaker frames of 15 x 11 mm, 16 x 9 mm, and 18 x 13 mm, create an acoustic cavity of approximately 1 cc to facilitate performance testing and evaluation of selected speakers.
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Advanced Energy Industries, Inc. has announced a new 1100W power factor correction (PFC) module for board mounting: the industry's first solution of its kind in a "half-brick" form factor.
The Advanced Energy AIH03ZPFC model is designed for applications in industrial, medical, defense, and telecommunications systems, where size, thermal performance, and efficiency are critical.
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Ezurio's Vela IF310 modules combine Bluetooth Classic and Bluetooth LE 6.0 connectivity with advanced audio features, enabling reliable wireless communication for automotive, medical, and industrial applications.
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With the HSI-H-MTD® cable set, Rosenberger presents a hybrid connectivity solution that combines the proven HSI (High-Speed Implement Bus) connector system on the tractor side with the compact H-MTD® high-speed data connector on the trailer side.
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The Texas Instruments CC330xMOD SimpleLink™ modules allow developers to quickly and easily incorporate advanced wireless connectivity into embedded systems, significantly reducing design complexity and time to market.
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The Telit Cinterion SL871K2 GNSS module is designed to provide accurate and reliable positioning for advanced IoT and navigation applications. This multi-constellation, single-frequency receiver can simultaneously track up to four GNSS constellations, including GPS, GLONASS, Galileo, BeiDou, QZSS, and SBAS systems, delivering optimized coverage even in complex environments or areas with low satellite visibility.
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SparkLAN, represented in Spain and Portugal by Mecter SL, offers three industrial-design wireless modules in its catalog, covering a technological transition from Wi-Fi 5 and Wi-Fi 6E to the advanced Wi-Fi 7. This range allows developers to choose the most suitable solution based on the product lifecycle, cost, and required performance, with reliable connectivity for critical environments.
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Siemens, in close collaboration with NVIDIA, announced that its Veloce™ proFPGA CS hardware-assisted verification and validation system is enabling system designers and architects to create more optimized designs by running and capturing trillions of verification cycles before the first silicon is available.
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Taoglas has announced the new FXP30x and PC30x series of high-performance embedded combo antennas. This new family of compact antennas is designed to support cellular, GNSS, and Wi-Fi® connectivity in space-constrained electronic devices.
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Tria Technologies™ has announced the availability of two new wireless modules: the SPB611 and the SPB209. These modules support various short-range protocols and help accelerate the development of wireless embedded systems.
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