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- Category: Batteries
Dukosi Ltd has collaborated with STMicroelectronics (“ST”) on a secure, end-to-end, comprehensive Battery Passport-ready battery management system (BMS).
The 16-channel proof of concept (PoC) with integrated cell-to-cloud encryption, secure authentication, and data management throughout the entire lifecycle was presented at Embedded World 2026.
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- Category: Batteries
Dukosi Ltd presents a novel module-level communication solution with near-field wireless connectivity, designed to offer safer and more reliable battery systems than traditional wired and long-range wireless communication designs.
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- Category: Test and Measurement Equipment
Teledyne SP Devices has announced a breakthrough in high-speed data acquisition thanks to the combined capabilities of its ADQ3 family of high-speed data acquisition cards and its proprietary NVMe streaming library, libads. Together, these technologies enable sustained disk write performance of tens of gigabytes per second, supporting long-duration data acquisition and recording for applications such as broadband signal capture, radar analysis, satellite monitoring, and scientific instrumentation.
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- Category: Sensors
Würth Elektronik presents the new WSEN-PDMS differential pressure sensor, offering high precision for a wide range of applications. The sensor boasts an accuracy of ±1 mbar and a 16-bit resolution, operates over a broad voltage range of 3.0 to 5.5 V, and is compatible with I²C and SPI digital interfaces, as well as an analog interface.
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- Category: Thermal control
Parker Hannifin's Chomerics Division announces the launch of its CHO-THERM™ HV series, a new line of thermal conduction interface pads offering enhanced levels of electrical insulation. This advanced range of materials combines high heat dissipation and electrical insulation performance with inherent vibration damping properties. Thermal conductivity ranges from 1.1 to 3.3 W/mK with breakdown voltages up to 20 kV under DC load.
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- Category: Software
XJTAG® presents its project exploration and sharing tool as a standalone application: XJBoardExplorer. This tool allows design teams to securely share complex electronic board data between production and service, both internally and with external manufacturers, through controlled, read-only access.
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- Category: Other Equipment
Teradyne, Inc. has announced the launch of Omnyx, an innovative manufacturing testing platform for printed circuit board assemblies (PCBAs) and subassemblies, designed to meet the specific testing requirements of artificial intelligence (AI) and data centers.
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- Category: Assets
Toshiba Electronics Europe GmbH (“Toshiba”) announces the launch of four new voltage-controlled photorelays: TLP3407SRB, TLP3412SRB, TLP3412SRHB and TLP3412SRLB — designed to meet the changing needs of design engineers working on state-of-the-art test and measurement equipment.
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- Category: Other Components
Circuit Design, Inc., a provider of low-power radio modules, has announced the launch of the STD-504, a 2.4 GHz radio transceiver module. Targeted at industrial applications, its small and compact size makes it ideal for integration into industrial equipment. The STD-504 utilizes the 2.4 GHz ISM band, enabling worldwide operation, and complies with EN, FCC, ISED, and ARIB standards, making it suitable for the global market.
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- Category: Seminars
Mouser Electronics, Inc. is expanding its comprehensive Autonomous Vehicle (AV) Resource Center, a solution designed to address the design constraints and system architectures associated with production-ready autonomy. The center examines the role of sensing, in-vehicle networking, and vehicle-to-everything (V2X) communications
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- Category: Integrated Circuits
ROHM has published the reference designs “REF68005,” “REF68006,” and “REF68004” for three-phase inverter circuits incorporating EcoSiC™ brand molded SiC modules “HSDIP20,” “DOT-247,” and “TRCDRIVE pack™” on the ROHM website. Designers can use the data provided in these reference designs to create the drive circuit boards.
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- Category: Current Affairs
Farnell has signed a new distribution agreement with Hongfa, a leading manufacturer of relays and electromechanical components. The agreement comes as demand for reliable, high-performance relay solutions continues to grow in industrial automation, automotive, energy, and smart building applications.
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