To improve electrical insulation between high-power components, the CHO-THERM HV series incorporates robust dielectric layers. In addition to impressive thermal performance, these properties are designed to meet the stringent engineering requirements of modern industrial and automotive systems. The materials exhibit a dielectric constant as low as -0.05 at 1 MHz (ASTM D150 test method) and a dissipation factor as low as 2.8 at 1 MHz (Chomerics CHO-TM-TP13).
“CHO-THERM HV marks an important addition to our technology portfolio, as it addresses the thermal management needs of systems where enhanced electrical insulation is paramount,” says Keith McDonald, International Sales Director at Parker Chomerics. “The materials offer superior performance in a wide range of applications, including automotive electronics and vehicle power systems, lighting assemblies, high-voltage sensors and actuators, and electric vehicle charging stations.”.
CHO-THERM HV is also suitable for alternative energy power conversion/inversion systems, heavy industrial equipment, and industrial motor controllers. Parker Chomerics designed the materials to provide effective heat transfer from heat-generating components, such as CPUs, GPUs, and high-power busbars, to heat-dissipating components, such as cold plates, heat sinks, cooling pipes, and vapor chambers.
Additional benefits include minimal outgassing, compliance with the globally recognized UL94 V-0 flammability standard, and ultra-low compression strength characteristics that simplify installation. With Shore 00 hardness ratings of 30–35, CHO-THERM® HV solutions easily conform to uneven or textured mating surfaces, eliminating air gaps and improving thermal contact.
Customers can now specify pads in standard sheet formats for high-volume processing or select custom die-cut configurations tailored to complex geometries. Four RoHS-compliant material variants are available, with Parker Chomerics specialists ready to assist with optimal selection. PSA (pressure-sensitive adhesive) bonding options are available when higher bond strength is required.
