The SIPLACE V platform has been designed from the ground up. It incorporates a machine frame, efficient linear drives, and measurement systems with improved resolutions that enable higher accelerations and greater accuracy. These advancements form the basis for substantial performance improvements under real-world production conditions. In key sectors for the electronics industry, such as automotive, consumer electronics, smartphones, and IT and networking technologies, SIPLACE V enables performance increases of up to 30% in actual production environments.
“After assembling approximately 25,000 flat modules and placing 7.3 million components, we can confirm that the field trial of the SIPLACE V platform in our high-mix, low-volume production has been a complete success. The new placement machines from ASMPT are once again setting new standards in performance, flexibility, quality, and effective productivity,” says Martin Zistler, Vice President of Global Engineering at Zollner Elektronik AG.
A key part of the SIPLACE V platform's performance boost is the evolution of ASMPT's placement head technology. With speeds up to 52,500 components per hour and an accuracy of 25 µm @ 3 σ, the SIPLACE CP20 collect-and-place head sets a new benchmark for high-speed applications.
The flexible CPP head can switch between collect-and-place, pick-and-place, and mixed modes via software commands. This versatility makes it ideal for complex mixed-assembly applications, processing up to 28,000 components per hour with placement forces of up to 15 newtons.
The SIPLACE TWIN VHF print head is designed for large or unusually shaped components. It processes components up to 200 × 150 × 28 millimeters and forces up to 100 newtons with complete reliability and maximum precision. With a capacity of up to 6,000 components per hour, it opens up new possibilities in areas such as the assembly of complex components, including BGAs, which are increasingly relevant in artificial intelligence applications.
With the SIPLACE V platform, ASMPT SMT Solutions covers the entire spectrum of components, from ultraminiature 016008M chips to large-format parts, demonstrating exceptional performance in the placement of complex or specially geometrized components.
A universal printhead interface allows for quick printhead changes even while the SIPLACE V is in continuous operation. It is available in single or double gantry versions and can be configured with single- or dual-lane conveyors. Optionally, a 3D coplanarity module can be integrated to verify component and board deformations, ensuring safe assembly even at maximum speed. Additional cameras further enhance accuracy in specialized applications.
The platform supports a wide range of PCB formats. With a dual conveyor, it processes boards up to 400 × 280 mm, and with a single conveyor, up to 700 × 530 mm. Furthermore, up to two tray units can be attached per machine. Another highlight is the significant increase in the number of feeder positions, regardless of pre-installed options such as Smart Pin Support, whose pins are handled directly by the placement heads, eliminating the need for a separate pin grabber.
ASMPT SMT Solutions integrates all these features into a footprint of only 1.1 × 2.4 meters, setting a new record for productivity per surface in electronic manufacturing.
ASMPT builds upon the proven quality features of the SIPLACE series and expands upon them with its new platform. Industry-leading features such as individually steerable nozzle segments, individual component inspection, and full traceability are standard on every machine. These are complemented by high-resolution cameras that ensure greater accuracy in the assembly process.
Another key factor in ASMPT's process reliability is its closed-loop sensor technology, which analyzes component heights and PCB profiles in real time, automatically adjusting placement forces. This ensures consistent quality even at high cycle rates.
The new SIPLACE V platform integrates seamlessly into ASMPT SMT Solutions' existing portfolio. Existing hardware components, such as feeders and cameras, can continue to be used without restriction. Similarly, all applications within the ASMPT SMT Solutions software ecosystem are fully compatible, from station software to applications in the WORKS Software Suite and Factory Solutions.
“Our new SIPLACE V platform integrates perfectly into existing line concepts,” explains Thomas Bliem, Vice President of R&D at ASMPT SMT Solutions. “This allows electronics manufacturers to modernize their production environments step by step, with complete investment protection. At the same time, the platform is ready to provide ideal conditions for future automation processes and AI-based applications.”
