The team is geared towards manufacturers of power modules based on Si, SiC and GaN technologies, where the reliability of the junctions and encapsulations is critical to the final performance of the device.
Non-destructive inspection for advanced assembly processes.
The increasing adoption of silver (Ag Sintering) and copper (Cu Sintering) joining technologies is driving the need for inspection tools capable of verifying the quality of internal interfaces without destroying the component. In this context, the X-SAM M51 uses high-frequency ultrasound to generate internal images of the device and detect defects such as delaminations, voids, cracks, porosity, or adhesion problems between materials.
Thanks to its non-destructive analysis capabilities, the system allows for the validation of manufacturing processes, optimization of sintering parameters, and the performance of periodic quality control checks on both prototypes and low-volume production.
Designed for laboratories and R&D environments,
the X-SAM M51 features a desktop configuration that facilitates its integration into research laboratories, technology centers, and process engineering departments. The system incorporates a secure, enclosed enclosure, a dedicated workstation, a 2K monitor, and an AMX-developed software interface to simplify acoustic image acquisition and analysis.
Key integrated features include:
High-precision acoustic microscopy.
Defect analysis using defect mapping.
Thru-scan function for advanced internal inspection.
Configuration and storage of test parameters.
Optional remote assistance tools.
Intuitive operation for R&D and quality control activities.
Verification of sintered joints and advanced encapsulations.
One of the main applications of the X-SAM M51 is the inspection of power modules subjected to sintering processes, a technology increasingly used in silicon carbide (SiC) and gallium nitride (GaN) devices due to their high thermal conductivity and ability to operate at high temperatures.
The system allows for the verification of interface quality after sintering, multilayer assembly, and advanced bonding processes used in:
Power modules for electric vehicles.
Industrial converters.
Energy storage systems.
Electronics for renewable energy.
Railway and aerospace applications.
Data center and high-performance computing infrastructure.
Automation and Traceability in Electronic Manufacturing:
The X-SAM M51 is part of the acoustic inspection platform developed by AMX Automatrix for the power electronics industry. The company also offers fully automated versions for production lines, enabling complete workflows from prototype development to series production with integrated traceability and quality control.
According to AMX, the combination of sintering and acoustic microscopy technologies provides an effective methodology for improving the reliability of next-generation power modules and reducing the costs associated with premature failures in demanding applications.
Key Features
: Technology: Scanning Acoustic Microscopy (SAM).
Equipment Type: Benchtop acoustic microscope.
Application: Non-destructive testing of electronic modules.
Usage Environments: Laboratory, R&D, and cleanrooms.
Analysis Functions: Defect Mapping and Thru-Scan.
AMX interface for data acquisition and analysis.
Inspection of sintering processes and other joining technologies.
Compatible with quality control and process validation software in power electronics.
