The YSi-SP is Yamaha Motor's first solder paste inspection (SPI) machine. It will be used to inspect the print quality (volume, height, area, misalignment) of the solder paste after it has been printed onto the PCB.
The YSi-SP handles several high-speed, high-precision solder paste inspections with a single head, including high-precision inspections employing a unique Yamaha algorithm that combines 2D and 3D-based measurements, and image resolution switching using super high-resolution technology.
Leveraging our experience as a comprehensive manufacturer of a full line of surface mount machinery, the YSi-SP can quickly coordinate with other Yamaha machines, such as making automatic setup changes, automatically adjusting for weld misalignment, and automatically converting adhesive inspection data from the dispenser.
While offering statistical process control (SPC) to perform a wide range of statistical processing, the YSi-SP can also be equipped with several optional features, including bond inspection and foreign matter inspection.
The launch of the YSi-SP allows us to supply all the primary machines required for assembly processes under the Yamaha brand, from printers and dispensers to solder inspection machines, surface mounters, and automated optical inspection (AOI) machines for PCBs. With all the machinery fully coordinated, customers can build a more efficient and higher-quality production line.
The YSi-SP is being showcased at the 47th Internepcon Japan electronics manufacturing and mounting technology exhibition held at Tokyo Big Sight (Koto-ku, Tokyo) from January 17 to 19, 2018.
