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- Category: Microcontrollers
Microchip Technology has introduced a new family of embedded motor drivers based on the dsPIC® DSC (Digital Signal Controller) for efficient embedded systems for real-time motor control in space-constrained applications. These devices incorporate a dsPIC33 DSC, a three-phase MOSFET gate driver, and an optional LIN or CAN FD transceiver in a single package.
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- Category: Current Affairs
Analog Devices, Inc. has announced that the company has entered into a special agreement with TSMC, a dedicated semiconductor foundry, to supply long-term wafer capacity through Japan Advanced Semiconductor Manufacturing, Inc. ("JASM"), TSMC's majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan.
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- Category: Encoders
Hohner Automation introduces the new MRH Series, distinguished by its ultra-compact design and robust mechanical construction. This non-contact incremental encoder is ideal for space-constrained applications. Its easy mounting between the motor and gearbox makes it compatible with all IEC electric motors, and its IP67 rating protects it against dust, liquids, and corrosion, even during high-pressure cleaning.
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- Category: Industrial Computing
ROHM has developed a new thermal printhead - KR2002-Q06N5AA - compatible with a single lithium-ion battery cell (3.6V) that achieves high-performance printing while improving energy savings by approximately 30%.
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- Category: Other Semiconductors
Renesas Electronics Corporation has announced the development of embedded processor technology that enables higher speeds and lower power consumption in microprocessor units (MPUs) implementing advanced vision AI. The technologies developed are as follows:
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- Category: Liabilities
Panasonic introduces the new ZV Series, an advanced hybrid electrolytic polymer capacitor that sets new industry standards in terms of:
- Higher ripple current: Achieving a maximum Ripple Current (3.3~4.6 Arms) approximately 50% higher than comparable case sizes from the competition, the ZV Series ensures superior performance in demanding applications.
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- Category: Software
Siemens Digital Industries Software has announced that its Calibre® nmPlatform tool for integrated circuit (IC) design verification and its world-class Analog FastSPICE (AFS) platform for verifying analog, radio frequency (RF), custom digital, and mixed-signal circuits are now certified for Intel 18A and Intel 16 process technologies. Intel 18A is also now enabled with Open Model Interface (OMI), the industry-standard platform for enabling aging modeling and reliability analysis, compatible with the AFS platform.
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- Category: Current Affairs
Farnell has announced its partnership with Auer Signal to offer customers a diverse range of audible and visual signaling devices, including stationary beacons, flashing beacons, strobe lights, horns, buzzers, and electronic sirens. Auer Signal has a century-long legacy of revolutionizing signaling solutions through innovation and a commitment to quality. Its design and development team uses cutting-edge technology and state-of-the-art machinery to create signaling devices that exceed industry standards.
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- Category: Other Equipment
Teledyne FLIR, part of Teledyne Technologies Incorporated, has unveiled two new Thermal by FLIR products in collaboration with Blackview and RealWear. The new Blackview BL9000 Pro 5G rugged mobile phone and the new RealWear Navigator™ Z1 assisted reality wearable both incorporate the FLIR Lepton® 3.5 microthermal camera module.
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- Category: Liabilities
Renesas Electronics Corporation has announced the development of circuitry technologies for a magnetoresistive random-access memory (STT-MRAM) test chip with fast read and write operations. Manufactured using a 22 nm process, the microcontroller unit (MCU) test chip includes an integrated 10.8-megabit (Mbit) MRAM memory cell array. It achieves a random read access frequency of over 200 MHz and a write performance of 10.4 megabytes per second (MB/s).
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- Category: Embedded Systems
The new board features a 64-bit quad-core Arm Cortex-A76 CPU clocked at 2.4 GHz, with 512 KB of L2 cache and a shared 2 MB L3 cache (greatly expanding the range of applications), as well as integrated dual-band Wi-Fi and Bluetooth 5 connectivity. The RP1 I/O controller chip, designed in-house for Raspberry Pi, delivers a significant improvement in interface performance.
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- Category: Embedded Systems
Electrification is driving the adoption of silicon carbide (SiC) technology in medium- and high-voltage applications such as transportation, power grids, and heavy vehicles. Microchip Technology today introduced the XIFM 3.3 kV plug-and-play mSiC™ gate driver, based on patented Augmented Switching™ technology
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