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Mouser Electronics, Inc. is proud to announce its support for the PENSKE AUTOSPORT group and the newly formed DS PENSKE Formula E team. For the upcoming ninth season of the ABB FIA Formula E World Championship, the PENSKE AUTOSPORT group will partner with the French automotive brand DS Automobiles.
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Strengthening ties between the food and technology sectors to provide digital and Industry 4.0 solutions that address the real needs of food companies for efficient water cycle management is the main objective of the NEXADA project.
This is a project promoted by three Innovative Business Groups (AEIs) from different sectors and autonomous communities: Galicia Food Cluster (Clusaga), Catalan Water Partnership (CWP) and Association of Knowledge and Applied Technology Industries of the Basque Country (GAIA).
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Mouser announces a new eBook in collaboration with Analog Devices, Inc., analyzing the latest innovations in power management and how they are used in various applications. The eBook, titled *Power Management for All of Tomorrow's Innovations*, explores new technological advancements for next-generation applications, such as electric vehicles, asset management, wearable devices, and the Internet of Things (IoT).
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Iberdrola has entrusted Ingeteam with the supply and commissioning of Europe's largest photovoltaic plant to date. This is the Francisco Pizarro solar plant, located in Cáceres, which reflects Iberdrola's commitment to equipping its projects with local technology.
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Norvento is participating alongside various Galician associations and companies in the Green Hydrogen Industrial Alliance, launched on December 21st by the Galician Regional Government (Xunta de Galicia). Norvento Enerxía is contributing its knowledge and experience in this field to this alliance, which aims to leverage the region's favorable conditions for green hydrogen production, in order to boost the value chain and generate an industrial footprint.
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AIMPLAS, the Technological Institute of Plastics, is participating in a new European project to develop new reusable plastic packaging. The BUDDIE-PACK project, funded by the Horizon Europe program, began on September 21 and 22 in Oyonnax, France, coordinated by the French Technological-Industrial Center for Plastics and Composites (IPC).
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Ingeteam's cutting-edge technology will make it possible to admire the immensity of the seabed ever more closely in a more sustainable way thanks to the electrical equipment it will supply for the Odón de Buen, a ship of the Spanish Institute of Oceanography that is destined to be the largest marine research vessel in Spain.
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Renesas Electronics Corporation and Fixstars Corporation today announced the joint development of a suite of tools that enables rapid software optimization and simulation for autonomous driving (AD) systems and advanced driver assistance systems (ADAS) designed for Renesas' R-Car SoC (system-on-chip) devices.
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IDTechEx forecasts that the lithium-ion battery market will grow to over $430 billion by 2033, driven by demand for electric vehicles. Electric vehicles (EVs) remain the primary driver of the lithium-ion market, and electric cars will be the largest market for lithium-ion batteries within the next decade.
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Cambridge GaN Devices (CGD), the factory-less clean-technology semiconductor company developing a range of energy-efficient GaN-based power devices to enable greener electronics, has signed an agreement with IFP Energies nouvelles (IFPEN), a major French public research and training organization in the fields of energy, transport and the environment, to develop an innovative automotive inverter using advanced GaN devices.
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Vicor today announced the third episode of its podcast series on the world's most innovative technologies, Powering Innovation. This episode examines the growth, challenges, and benefits of electric and hybrid aircraft.
In this third installment of Powering Innovation, Robert Gendron of Vicor talks with Ed Lovelace, Chief Technology Officer of Ampaire, about electrified aviation: from short-haul cargo to supersonic transport.
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Congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new high-performance COM-HPC Mini specification for credit card-sized (95x60mm) Computer-on-Module (COM) modules. The new COM-HPC Mini standard is now in the final stages of ratification, expected in the first half of 2023.
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