This improved reliability makes the new substrates ideally suited for high-power applications, such as in EVs/HVs, vehicle electrification, industry, renewable energy, and public transport. curamik® Endurance expands the application range of DBC.
Curamik Endurance substrates:
• Curamik Endurance (Al2O3)
• Curamik Endurance Plus (HPS)
• Curamik Endurance Thermal (AlN)
Thermal cycling tests demonstrate that curamik® Endurance substrates have a significantly longer lifespan compared to their alternative standard ribbed DBC substrates (AlN, Al2O3, HPS (ZTA)).
To achieve this increased reliability, Rogers has refined the copper sidewall design for optimal stress relief. All currently available material combinations are based on a copper thickness of 0.3 mm. The Al2O3, HPS (ZTA), and AlN ceramic types can be selected by referring to our curamik® Ceramic Substrate Design Rules – DBC Technology.
Properties:
• Copper thickness: 0.3 mm
• Ceramic types: Al2O3, HPS, AlN
• Thermal conductivity: 24, 26, 170 W/mK
• Ceramic thickness: as per standard. Design standards
The Design Support Hub offers comprehensive technical information on ROLINX busbars, capacitor bar assemblies and curamik ceramic substrates, a library of technical documents on product design and troubleshooting, and helpful videos on products and power distribution topics.
