WE-HIC consists of classic finned heatsinks for flat-surfaced components such as CPUs or DC/DC converters, which generate significantly more heat. The WE-HTOI and WE-HICI variants are supplied pre-applied with the thermal conductive material. This eliminates air gaps between the component and the heatsink, maximizing cooling performance. As a special service, Würth Elektronik provides technical support, detailed technical specifications for the heatsinks, simulation capabilities, and customer-specific modifications.
WE-HTO heatsinks are available in various formats, with different surface areas to provide cooling power tailored to specific needs. For example, there are versions with curved plates and even cooling fins, which dissipate more heat thanks to their larger surface area. Additionally, M3 screws, nuts, and insulating bushings suitable for mounting on WE-HTO and WE-HTOI heatsinks are available upon request.
Cooling fins for different airflows
WE-HIC is available in two variants: with continuous fins and with interrupted fins. The version with continuous fins is suitable for applications where the defined airflow is clearly directed along the fins. On the other hand, the variant with interrupted fins is ideal when the airflow patterns in the mounting situation cannot be clearly determined. The IC heatsinks are available in sizes from 20 × 20 to 40 × 40 mm.
“We have been supplying heat dissipation materials for some time, and during our expert design consultations with customers, we always consider temperature management in addition to EMC. Therefore, it makes sense to expand our range of heat sinks. After all, preventing overheating helps maintain performance and extend the lifespan of components,” explains María Cuesta Martín, Product Manager EMC Shielding & Thermal Materials at Würth Elektronik eiSos GmbH & Co. KG.
Würth Elektronik heat sinks are now available from stock with no minimum order quantity. Free samples are available upon request.
