Today, as designers strive to pack more functionality into every printed circuit board, signal integrity is more important than ever. At the same time that devices are becoming thinner, smaller, and more compact, finding space on printed circuit boards is a challenge.
The new CoolZorb 400 offers designers much-needed flexibility, improving signal integrity and temperature stability, all with a single solution. This innovative product accelerates the design cycle, simplifies manufacturing processes, and reduces material costs. CoolZorb 400
is a hybrid material that functions as both an electromagnetic interference (EMI) absorber and a thermal conductor. It is used like a traditional thermal interface material, placed between the heat source, such as an IC, and the heatsink or other thermal transfer device or metal chassis. This silicon-based material can simultaneously protect electronic components from both EMI and heat, allowing design engineers to save space and money.
“As a result of the multiple new and emerging pressures facing electronics system manufacturers in sectors such as information/communication technologies, wireless systems, telecommunications infrastructure, and smartphones/tablets, the application of thermal management and EMI shielding strategies has become more complex,” commented Naoto Mizuta, Senior Vice President of Performance Materials at Laird. “The use of hybrid solutions like the CoolZorb 400 to address both thermal and EMI challenges is poised for significant growth in the coming years.”.
The product is available in sheets (12" x 12") and as custom-cut pieces. Standard sheet thicknesses are 0.020", 0.040", and 0.100", but other thicknesses are available upon request.
CoolZorb 400 delivers thermal conductivity and EMI attenuation in the microwave frequency range, with optimal performance at 5 GHz and above. It also meets the UL94 V0 flammability requirements.
