The company's TECHNOMELT product line, for example, now includes the TECHNOMELT TC 50 thermal conductor. With the benefits of low-pressure molding encapsulation, the encapsulation also has the ability to dissipate heat through the encapsulating layer to prevent overheating and increase reliability and uptime. Another hot innovation, TECHNOMELT AS 8998, provides an automated, peelable masking solution for conformal coating processes and is compatible with Henkel and other conformal coating materials.

For PCB assemblies requiring value-added environmental protection, Henkel's portfolio of packaging materials offers durable encapsulation and protection, along with functional capability. With formulations providing high temperature resistance, weight reduction, and/or thermal conductivity, Henkel has a complete range of packaging systems to meet numerous applications and performance requirements.
 
Robust Thermal Management Solutions:
As device dimensions have decreased alongside increased functionality, thermal control has become more challenging. Henkel's Gap Filler dispensing materials enable compliance with complex architectures while offering an automated solution for high-volume environments. Well-suited for fragile, low-stress applications, Gap Filler materials are available in a variety of formulations, including the self-cleaning Gap Filler 1400SL and the low-volatility Gap Filler 3500LV.

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