The Hi-Flow 650P is a new addition to Bergquist's versatile Hi-Flow family, which offers a selection of insulating and non-insulating materials as a cleaner and easier-to-use alternative to thermal grease for interfaces between components and heat sinks. Hi-Flow materials are solid at room temperature but phase-change at higher temperatures to fully saturate the interface without overflowing. The Hi-Flow 650P phase-changes at 52°C.
With a rated operating temperature up to 150°C, the Hi-Flow 650P is suitable for use in automotive systems such as under-hood electronic control units and other equipment exposed to harsh conditions. Featuring a high thermal conductivity of 1.5 W/mK, this new formula ensures efficient heat transfer from the sensitive semiconductor device to the attached heat sink. The polyamide reinforcing film provides high resistance to shear and dielectric breakdown.
The Hi-Flow 650P is available in sheet, roll, and custom sizes with thicknesses ranging from 0.114 mm to 0.140 mm. Bergquist recommends using elastic clips to maintain consistent pressure for optimal thermal performance at component and heatsink interfaces.
