Unlabeled

• Curamik® Endurance Direct Bond Copper Ceramic Substrate

  Rogers Corporation's Advanced Electronics Solutions (AES) group introduces curamik Endurance substrates, which are direct-bond copper ceramic substrates with enhanced properties. curamik® Endurance substrates provide improved reliability performance compared to...

• 3D Architech joins Taiwan's startup ecosystem through the Garage+ Startup Global Program, revolutionizing metal 3D printing

  Taiwan's Global Garage+ Startup 2024 program boasts a record 31 startups from around the world, selected from 330 applicants. These startups focus on AI, sustainable living, space technology, and IoT. In particular, 3D Architect is innovating with its technology...

• Electromagnetic interference (EMI) absorber that dissipates heat from components

  Laird has announced the launch of an innovative dual-function board-level material that simultaneously improves signal integrity and temperature stability of electronic circuits.

• Liqui-Bond SA 3505 High Thermal Conductivity Adhesive

  Bergquist presents the high thermal conductivity adhesive Liqui-Bond SA 3505, which allows for reduced cost and time associated with bonding using clamps or screws in power supply heat sinks and applications with discrete components.

• Epoxy resin adhesives and coatings for electronic design

  RS Components (RS), a trading brand of Electrocomponents plc, presents the new range of coatings from MG Chemicals, specifically designed for prototyping and production in the electronics field.

• Gap Filler Pad

  Parker Hannifin Corporation's Chomerics division has launched the 70TP THERM-A-GAP™ PAD, an ultra-soft (15 Shore hardness), adaptable, and thermally conductive gap-filling pad.

  The 70TP THERM-A-GAP™ PAD offers a combination of high thermal conductivity (7.0 W/mK) and...