high thermal conductivity with an exclusive formula designed to adapt to complex architectures.
Gap Filler 1400SL is a two-component, silicone-based liquid gap-filling material with extremely low viscosity, allowing it to flow into and around narrow, complex-shaped structures to fill small gaps and provide excellent heat transfer. With a thermal conductivity of 1.4 W/mK, Gap Filler 1400SL combines high thermal conductivity and exceptional flowability—characteristics that have traditionally been mutually exclusive—enabling new levels of design creativity.
“Previously, electronics professionals used conductive filler compounds with relatively low thermal conductivity,” explains Lonnie Helgeson, Henkel Product Manager for Gap Filler materials. “Manufacturers no longer need to sacrifice viscosity or thermal conductivity. With Gap Filler 1400SL, these properties are combined in a new self-leveling material that also provides shock and vibration damping.”
When cured, Gap Filler 1400SL is exceptionally soft, allowing it to absorb the stresses caused by the coefficient of thermal expansion (CET) and providing shock absorption for fragile structures. The material is ideal for a wide range of applications, including high-power components such as field-effect transistors (FETs), industrial controllers with temporary loads, and automotive electronics such as DC-DC converters for hybrid vehicles.
“Gap Filler 1400SL is also a low-VOC material,” Helgeson adds. “This product’s low-VOC formulation helps solve the clouding problem caused by outgassing that occurs in certain applications.”.
Because it sets at room temperature without generating byproducts, Gap Filler 1400SL provides consistent setting throughout the compound, with no thickness limitations and the ability to accelerate setting with exposure to elevated temperature.
