The new ThermaWick™ THJP series SMD heat dissipation chip reduces heat from electrically isolated components, lowering the temperature by more than 25%. This allows for greater power control capacity or a longer application lifespan while maintaining dielectric strength or insulation.
It protects adjacent devices from thermal loads, improving overall circuit reliability by enhancing heat dissipation.
- Details
- Category: Thermal control
Vishay ThermaWick SMD Heat Dissipation Chip
Vishay Intertechnology, distributed in Spain and Portugal by RC Microelectrónica, presents the ThermaWick™ THJP series SMD heat dissipation chip. The Vishay Dale Thin Film device allows designers to dissipate and redirect heat from electrically isolated components by providing a thermally conductive path to a standard copper plane or heatsink.
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