THERM-A-GAP™ CIP 35E offers a flow rate that enables high-speed, large-scale dispensing. With a 1:1 mix ratio and availability in various container types and sizes, customers can quickly dispense using a static mixing tip installed on manual or automated equipment. For added convenience, there is no need to premix, weigh, or degas the two components.
After curing, THERM-A-GAP™ CIP 35E acts as a low-hardness (50 Shore 00) gap pad that conforms to irregular shapes and maintains effective contact without transmitting compressive forces to adjacent electronics. Its ability to cure into complex geometries is ideal for cooling components of varying heights on a printed circuit board (PCB) without the expense of a molded sheet. The product also offers vibration damping properties.
It offers benefits in electronic applications including energy storage systems, power electronics, consumer electronics, and a wide range of commercial and industrial devices. Any task involving heat dissipation between an electronic component, such as a semiconductor or battery, and a heat-dissipating surface will benefit, especially those involving complex or unconventional shapes.
In accordance with the RoHS directive, the electrical insulation properties of THERM-A-GAP™ CIP 35E include: 8 kVac/mm dielectric strength (ASTM D149 test method); 1013 Ωcm volume resistivity (ASTM D257); 8.0 dielectric constant at 1,000 kHz (ASTM D150); and 0.009 dissipation factor at 1,000 kHz (Chomerics CHO-TM-TP13).
