THERM-A-GAP TPS60, designed for effective heat dissipation in telecommunications, IT, and automotive applications, consists of a soft silicone matrix (Shore 00-35) filled with heat-conducting particles. This results in exceptional malleability as a putty-like material.
 
This innovative filler material offers low thermal contact resistance at low pressure and is ideal for filling air gaps between PC boards or high-temperature components, as well as heat sinks, metal enclosures, and chassis. With its superior thermal performance and long-term stability, the product offers several advantages over conventional thermal barriers.
 
It is important to note that the product's malleability, along with its high thermal conductivity, reduces the risk of damage to fragile components and ensures rapid heat transfer away from electronic components. As a high-performance material, THERM-A-GAP TPS60 is ideal for applications where heat dissipation is critical, such as thermally advanced BGA (ball grid array) packages, memory modules and packages, and GPUs/CPUs. A woven version is also available to improve tear resistance and ease of handling.
 
THERM-A-GAP™ TPS60 offers standard thicknesses from 1.0 to 5.0mm, and among the other features of this RoHS compliant product are a thermal conductivity of 7.5W/mK at 20psi, electrical insulation and a specific gravity of 3.26.

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