Bond-Ply® 800 boasts the highest thermal conductivity in the Bond-Ply range at 0.8 W/mK, making it ideal for installing heat spreaders or heat sinks on assemblies such as LED lighting modules, motor controllers, power converters, or high-performance processors. This double-sided tape features a fiberglass backing and is durable, easy to handle, and quick to use in a production environment. The acrylic adhesive ensures high bond strength, and with a thermal impedance of 0.60°C-in²/W (at 50 psi), Bond-Ply 800 provides efficient heat transfer capabilities as well as excellent levels of convenience and reliability.
Available in sheets, rolls, or die-cut, the tape significantly reduces labor and material costs and helps increase production rates by eliminating the time required for mechanical fixings or high-temperature curing. There are two standard thicknesses available that allow you to choose between 0.127mm or 0.203mm which offer a low coefficient of expansion, high tensile strength and a dielectric breakdown voltage of 4000V or 6000V respectively, thus ensuring robust electrical insulation.
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- Category: Thermal control
Pressure-sensitive, thermally inductive adhesive tape that adheres at room temperature
Bergquist presents its new high-performance, thermally inductive, pressure-sensitive adhesive tape that cures at room temperature to allow for quick and efficient assembly without the need for mechanical fixings or high-temperature curing.
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