Uses include desktop computers, laptops, servers, telecommunications equipment, and memory modules for both consumers and automotive electronics.
The main advantage of THERM-A GAP™ MCS30 filled thermal pads is that their crosslinked soft gel structure provides superior performance and long-term thermal stability compared to conventional thermal pads. Specifically, Chomerics designed the thermal interface material for use in applications requiring low compressive forces.
Ease of handling and application are also important features of this range of advanced products, hence the presence of two natural turning sides. Furthermore, the inherent softness of THERM-A GAP™ MCS30 facilitates its adaptation to irregular surfaces.
Another point to mention is that Chomerics has developed a product that not only exhibits superior long-term physical and thermal reliability, but also demonstrates resistance to thermal oxidation degradation associated with continuous application temperatures up to 200°C.
THERM-A GAP™ MCS30 is available in standard thicknesses from 0.5 mm to 5.0 mm, although custom thicknesses can be ordered upon request. Product features include a thermal conductivity of 3 W/mK @ 20 psi, electrical insulation, low gas emission (0.06%), and low silicone extractable properties (0.25%). It is RoHS compliant and offers a shelf life of 24 months from the date of manufacture.
