The i-Cube10 (YRH10) was developed as the successor to the long-established i-CubeIID (YHP-2D), which has been recognized for its space-saving design, as well as its excellent productivity and versatility, featuring a hybrid device placer and wafer feeder as standard equipment. The new i-Cube10 (YRH10) maintains the same high processing compatibility, accommodating a wide range of electronic components and semiconductor packages, but boasts 50% greater throughput and assembly accuracy, achieving a chip assembly speed of 10,800 CPH from wafer feed and an assembly accuracy of ±15 μm.
The main features are: 1) High-speed productivity through optimization of the recognition camera operations for the mounting head and wafers, component recognition via the head-mounted scanning camera, the adoption of a 10-nozzle mounting head, and accelerated wafer exchanges; and improved assembly accuracy through the adoption of a high-rigidity conveyor, optimized axis control, a heat compensation function, etc., 2) High versatility enabling the assembly of surface mount devices (SMDs) as well as wafer components with a single unit, and 3) Easy-to-use functions, such as a wafer pickup condition configuration utility that can optically set the conditions of the wafer parts, a newly developed user interface with greater ease of use, and a feeding unit capacity that doubles that of previous models.
Market Background and Product Description:
In recent years, the trends toward smaller, thinner components, reduced power consumption, increased functionality, and greater diversification have accelerated in electronic component assembly and semiconductor packaging production facilities, and the implementation of even more sophisticated processes is progressing. In turn, the market now demands not only greater assembly accuracy than ever before, but also increased productivity, which directly impacts packaging costs.
The new i-Cube10 (YRH10) represents the first redesign in 14 years—since 2007—and is a rapid response to the aforementioned changes and market demands, achieving a 50% improvement over previous models in both assembly accuracy and productivity. With the ability to assemble various types of components, such as surface mount devices and wafer components, with a single unit, we aim to further strengthen our sales in the electronic components and semiconductor packaging markets.
With our unique 1-stop smart solution concept, we leverage our position as the industry-leading manufacturer with a full line of SMT equipment—from SMD storage, solder paste printers, and glue dispensers to surface mounters and AOIs—and, to create smarter factories, we will deliver new value through high-level integration and coordination between our line equipment, eliminating the need for black boxes.
Product Features
1) High-Speed and High-Precision Assembly
The operation of the assembly head and wafer chamber has been optimized, eliminating all waiting time losses for the units. Furthermore, by equipping the head with a scanning camera, component recognition after wafer pickup is completed during movement, enabling the shortest path to the assembly position and creating an efficient operation cycle. In addition, the number of nozzles on the assembly head has been increased from 4 to 10, drastically reducing the number of head cycles required per number of components to be assembled. Thanks to these features, the i-Cube10 (YRH10) achieves a high bare chip assembly speed of 10,800 CPH (when wafers are supplied).
Wafer replacement time has also been shortened, and it's even possible to manufacture products with multiple chips that require frequent wafer replacement without compromising performance.
This unit also helps achieve high-quality production by effectively utilizing our ball/emboss component recognition system, refined through the development of our flip-chip fixers, such as the YSB55w.
In addition, the frame rigidity was thoroughly reviewed. A high-rigidity conveyor was adopted to reduce its dynamic vibration during spindle operation, and optimization of the axis control parameters, a heat compensation function, and more achieve and maintain the unit's high assembly accuracy of ±15 μm (μ+3σ).
2) High versatility.
Since the i-Cube10 (YRH10) can mount various types of components, such as surface mount devices and wafer components, a single unit can be used for assembly operations instead of having to divide the tasks between several devices, as was previously necessary. This reduces costs and installation space.
The unit is also equipped with several features that facilitate its great versatility, such as a non-stop wafer feeding unit that can configure up to 10 wafers, compatibility with printed circuit boards up to 330 mm (L) × 250 mm (W) in size, automatic tool replacement and a dual push-up unit.
In addition, the i-Cube10 (YRH10) is also compatible with the automatic load feeder for which Yamaha surface mounters are known, and can always supply tape reel components without stopping production or requiring the selection of the supply time.
3) Easy Operation:
The wafer pickup condition configuration utility allows you to visually set the conditions for the wafers, making the task require little to no skill and further supporting operator efficiency.
In addition, the i-Cube10 (YRH10) is packed with user-friendly features, such as a newly developed, more intuitive user interface and a feeder load capacity that is double that of previous models.
