The YRi-V has been developed as a high-end version of the best-selling YSi-V 3D hybrid AOI system, which combines 2D inspection, 3D inspection, and a 4-way angle camera in a single machine. By adopting a newly developed inspection head equipped with a high-speed, high-resolution camera, an upgraded 3D projector, a high-performance GPU, and more, the YRi-V achieves the fastest inspection speed in the industry. Furthermore, inspection performance has been significantly improved while simultaneously increasing previous levels of convenience and functionality. This includes enhanced inspection capabilities for ultra-small, fine-pitch components and the detection of scratches, cracks, chipped areas, and similar defects on surfaces such as mirror finishes—a previously challenging task.
Key features include: 1) high levels of both speed and accuracy through the adoption of a newly developed inspection head equipped with a high-speed, high-resolution camera and an 8-way high-precision 3D projector; 2) more functionality, such as greater component inspection compatibility thanks to new coaxial lighting and more supported PCB lengths via revised conveyors; and 3) greater ease of use thanks to the use of AI-powered deep learning and other changes to simplify, automate, and reduce the skill requirements for creating inspection data, conversion, adjustment, etc.
Market background and product outline
The reliability demonstrated by SMT processes directly impacts the market value of products. In recent years, the SMT technology field has seen an accelerated shift towards smaller sizes, higher densities, greater functionality, and increased diversification. To ensure the reliability of printed circuit boards, fast yet accurate assembly quality inspection of all components using automated optical inspection (AOI) will be even more crucial. Furthermore, the market has recently seen a significant increase in the use of extremely small, thin WLCSP and FOWLP components, which have a specular surface finish. Thus, in addition to the challenges of inspecting components with specular surfaces, there is a growing need for compatibility in assembling ultra-small components with a fine pitch.
The YRi-V has adapted to these market changes and demands from the outset. This AOI system significantly improves inspection capabilities in both speed and accuracy, with increased detection capacity for ultra-small components as small as 0201 (0.25 mm x 0.125 mm) and mirror-finish components.
Furthermore, with our unique 1-stop smart solution concept, we leverage our position as the industry-leading manufacturer of a complete line of SMT equipment—from SMD storage, solder paste printers, and glue dispensers to surface mount units and AOIs—to deliver new value through high-level integration and coordination across our line equipment, eliminating the need for black boxes.
Product features
1- High Speed and High Precision:
The new inspection head features the existing 12 μm and 7 μm resolution lenses, as well as a new 5 μm resolution lens compatible with ultra-small chip components as small as 0201. The YRi-V incorporates a completely new, brighter illumination system and is also equipped with the industry's fastest high-speed, high-resolution camera with a higher frame rate. The use of a high-performance GPU enables greater image processing capacity, achieving incredible speeds—almost twice that of the current YSi-V TypeHS2 at 7 μm and 1.6 times at 12 μm.
The upgraded 3D projector has also enabled even more precise inspections, as both measurement accuracy and range have been doubled compared to current models, and it is now possible to perform high-precision measurements up to 25 mm in height.
Furthermore, by combining the 5 μm lens and an 8-way 3D projector, it is possible to perform high-precision 3D inspections of ultra-small chip components of size 0201 and fine-pitch components with high-resolution images without the effects of component blind spots.
2- Enhanced Functionality:
The new coaxial illumination of the inspection head enhances the ability to detect scratches, cracks, and chipped areas on components with a mirror-like surface, and detection sensitivity has also been improved.
Furthermore, the revised conveyors expand the range of compatible PCB lengths, allowing for the flexible handling of longer PCBs, up to 1,200 mm (with optional accessories). In a dual-lane configuration, the more flexible adjustment of the fixed positions of lanes 2, 3, and 4 has improved versatility when linking with other equipment.
3- Improved Usability:
Intuitive operation is made possible by the next-generation design of the graphical user interface. Furthermore, the automation of various functions, the integration of AI, and other features have allowed us to offer a comprehensive range of support functions for creating and fine-tuning inspection data without requiring operators to have a high level of expertise.
- During data conversion:
It is possible to convert CAD/CAM/YGX data into inspection data in a single step. Furthermore, the machine supports Gerber data as standard and automatically generates virtual board images.
- When creating data:
It is easier to create inspection data with features such as offline data creation, individual configuration of 3D projector conditions, and automatic creation of through-hole data from raw plate images.
- When adjusting data:
Data adjustment time is halved thanks to the elimination of inspection frames (automatic calculation), the automation of lighting parameters, and automatic position correction that accurately accounts for the degree of component misalignment.
Furthermore, AI deep learning identifies the component type from the component image and automatically establishes the ideal component library. It also greatly promotes automation and labor savings, such as automating the creation of new component libraries and assisting with secondary visual checks and decisions.
