Typical use cases range from all connected embedded, industrial, and IoT applications to new systems with built-in artificial intelligence that require the latest high-end embedded performance with even greater energy and cost efficiency than previously released high-end Gen 8 Intel Core i5 and Core i7 versions.
Detailed Features:
The new conga-TS370 COM Express Basic Type 6 module with a quad-core Intel Core i3 8100H processor offers a TDP of 45 watts, configurable to 35 W, supports 6 MB of cache, and provides up to 32 GB of dual-channel DDR4 2400 memory. Compared to the previous 7th generation Intel Core processors, the improved memory bandwidth also helps boost the graphics and GPGPU performance of the new integrated Intel UHD Graphics 630, which also boasts an increased maximum dynamic frequency of up to 1.0 GHz for its 24 execution units. It supports up to three independent 4K displays at up to 60 Hz via DP 1.4, HDMI, eDP, and LVDS. For the first time, designers can now switch from eDP to LVDS simply by modifying the software without any hardware changes. The module also provides exceptionally high-bandwidth I/O, including four USB 3.1 Gen 2 (10 Gbit/s) ports, eight USB 2.0 ports, one PCIe PEG port, and eight PCIe Gen 3.0 lanes for powerful system expansions, including Intel Optane memory. All common Linux operating systems are supported, as well as 64-bit versions of Microsoft Windows 10 and Windows 10 IoT. Congatec's unique Personal Integration Support completes the feature set. Furthermore, Congatec offers a wide range of accessories, including efficient cooling solutions that help improve reliability and MTBF, as well as comprehensive technical services that simplify the integration of new modules into customer-specific solutions.
