The new modules are designed to provide efficient entry into industrial AI edge applications in markets such as transportation, healthcare, smart city infrastructure, gaming, point of sale, robotics, and industrial automation. They accelerate embedded applications with a combined AI inference performance of up to 59 TOPS, with up to 50 TOPS provided by the XDNA2 NPU and the remaining performance delivered by up to 6 AMD Zen5 CPU cores and the RDNA3.5 GPU. Customers looking to balance their application between efficient CPU/GPU/NPU performance, configurable thermal design power (TDP) from 15 to 54 W, and SWaP-C (size, weight, power, and cost) requirements will particularly benefit from the high scalability of the new modules.
With the conga-TCRP1, congatec expands its broad portfolio of AI-accelerated x86 COM (Computer-on-Modules) with a module offering an industrial temperature range of -40 to +85 °C. Customers can easily scale their applications across a wide range of performance and power requirements. The configurable minimum TDP of just 15 W simplifies the development of passively cooled, fully enclosed designs. This makes the new conga-TCRP1 ideal for use in rugged handhelds, hygienic medical PCs, and mission-critical devices in harsh environments.
The conga-TCRP1's compute cores are based on the AMD Zen5 architecture, combining performance-oriented Zen5 cores with Zen5c cores designed for maximum energy efficiency. This ensures extremely low power consumption from the modules while delivering high overall efficiency and single-threaded performance of up to 4.5 GHz. A key advantage for application developers is that the Zen5 and Zen5c cores are based on the same architecture. This guarantees consistent execution in deterministic applications and optimizes real-time performance.
In addition to the Zen 5/5c cores and Radeon™ RDNA 3.5™ GPU, which supports up to four independent display connections with immersive 4K graphics, the integrated XDNA2 NPU delivers up to 50 TOPS of AI performance. This enables local execution of real-time processing of smaller language models (LLMs) without the need for cloud connectivity or discrete accelerators, in a cost-effective and energy-efficient manner.
At the same time, memory-intensive applications benefit from up to 96 GB of DDR5-5600 RAM with optional Error Correction Code (ECC) for mission-critical applications. Up to eight fully configurable PCIe Gen4 lanes and PEG x4 Gen4 are available for fast data transfer and connecting low-bandwidth peripherals such as industrial Ethernet, fieldbus adapters, or radio modules. Additionally, 2.5 GbE ensures fast networking, and four USB 3.2 Gen2 and four USB 2.0 ports provide connections for additional devices. For data storage, the modules offer up to 512 MB of integrated NVMe SSD or two SATA 6 Gb/s ports for external media. One I²C bus, GPSPI, two UARTs, eight GPIOs, one SMBus, and one LPC complete the feature set. The adjustable TDP of 15 to 54 W ensures that customer applications can be easily adapted to individual requirements without having to implement new product versions with other derivatives.
Supported operating systems include Microsoft Windows 11, Windows 11 IoT Enterprise, Linux, ctrlX OS, Ubuntu Pro, and Kontron OS.
As application-ready aReady.COM modules, they can be pre-configured with licensed ctrlX OS, Ubuntu Pro, and Kontron OS. The aReady.VT option, with an integrated hypervisor, allows developers to consolidate multiple workloads, such as real-time control, HMI, AI, and IoT gateway functions, into a single module. For IIoT connectivity, congatec offers the aReady.IOT software building blocks. These enable data sharing, remote maintenance and management of the module, baseboard, and peripherals, as well as cloud connectivity if required. To further simplify application development, congatec offers a comprehensive complementary ecosystem, including evaluation and ready-to-use baseboards, custom cooling solutions, complete documentation, design services, and high-speed signal integrity measurements.
