In fact, recommendations for system ventilation design are often included, significantly reducing the thermal design effort at the system level. Perfectly matched cooling solutions are essential for the 100-watt edge server ecosystem, as overheating can lead to rapid aging and system failures. Edge servers with real-time requirements also need optimal protection against thermally induced performance degradation to ensure deterministic behavior, further underscoring the importance of high-performance cooling systems in industrial computing systems.
"AMD EPYC Embedded 3000 processors are the flagships of a new era of embedded systems. They fulfill important edge server functions but also produce more waste heat than conventional embedded systems. That's why we've worked hard to create a 100-watt ecosystem for high-performance COM Express modules that meets the robust design requirements for 24/7 operation. Now we're presenting three of these solutions for the first time at Embedded World 2020," explains Andreas Bergbauer, Product Line Manager at congatec.
"AMD EPYC Embedded 3000 Series processors enable a wide range of embedded edge server designs. It's great to see companies like congatec investing in providing a complete ecosystem with Server-on-Modules (SoMs) and all the necessary accessories, such as these powerful cooling solutions, which will help simplify designs and help end customers get systems up and running faster," explains Stephen Turnbull, director of product management and business development, Embedded Solutions, AMD.
Congatec's cooling solutions for the 100-watt ecosystem surrounding AMD EPYC Embedded 3000 processors come in three variants, all based on the COM Express heatsink specification standardized by the PICMG: a heatsink with a heat pipe adapter; a heatsink with an integrated heat pipe; and an active cooling solution. Along with the standard COM Express heatsinks, OEMs can now choose from four variants covering the full range of processor cooling solutions.
COM Express Heatsink Heat Pipe Adapter:
The conga-B7E3/HPA heat pipe adapter absorbs waste heat from the heatsink via up to four heat pipes and directs it, for example, to other passive heatsinks mounted on the case. This enables the design of extremely powerful passive cooling systems up to 100 watts.
COM Express Heatsink with Integrated Heat Pipe:
The integrated heat pipe solution, conga-B7E3 / HSP-HP, was developed primarily for particularly flat embedded systems where a standard-height COM Express heatsink needs to be attached to the case. Here, the integrated heat pipe distributes waste heat from the processor evenly across the heatsink, preventing hot spots, even in applications with a TDP of up to 100 watts.
Active Cooling System for Robust 24/7 Operation:
The conga-B7E3 / CSA-HP fan-based active cooling system is specifically designed for 24/7 operation in harsh industrial environments. In this comprehensive cooling system for COM Express modules, the fans are not only mounted extra securely but also specifically designed to minimize wear. Furthermore, the bearings are equipped with a special seal and an additional cover to provide maximum protection for both the mechanical components and the lubricant. Using high-performance synthetic oil as a lubricant, the fan boasts an MTBF of several decades, operating within an industrial temperature range of -45 to +85°C and offering industrial-grade shock and vibration resistance. The functional scope of this fan-based active cooling system is further enhanced by the integration of a heat pipe to dissipate waste heat from the processor even before it reaches the active fan.
