Operating within a wide temperature range of -40°C to 85°C, the MIO-2261 measures only 100 x 72 mm. It boasts low power consumption and a compact size, and is equipped with multiple I/O interfaces and an Advantech MIOe connector, allowing for easy expansion with additional functions. This small, all-in-one module facilitates more efficient development with fewer resources and enables customers to retain their proprietary know-how.
The wide operating temperature range takes reliability to the next level.
The MIO-2261's broad operating temperature range and variety of I/O meet reliability requirements in all application fields. Product features include:
- Wide Temperature Range Design: The MIO-2261 is designed with components for a wide temperature range, including a management IC that prevents poor power conversion efficiency when a temperature increase occurs. 100% solid capacitors ensure consistent stability due to their comparatively high melting point (350°C), which is much higher than electrolytic capacitors (120°C). The MIO-2261 uses a high-heat-resistant TG-150 PCB for stable, high-quality production. All these material considerations ensure that the MIO-2261 maintains its shape and electrical characteristics.
- Enhanced Reliability Design: The MIO-2261 features a single 12V DC power input with a +/- 10% tolerance. It incorporates DC hot-plug protection, safeguarding against current fluctuations that could damage the board when directly connected to or disconnected from DC power. For greater reliability and the ability to withstand harsh conditions, the Advantech MIO-2261 is designed with an industrial-grade ESD COM port driver IC (15KV air protection/8KV contact protection for RS-232) and a TVS (Transient Voltage Suppressor) design on the power input side to protect the MIO-2261 from transient voltages induced by lighting or other transient voltage events. The MIO-2261 is a reliable SBC solution, well-designed with high-quality materials and supported by advanced integration and customization services.
- Improved Thermal Design: The MIO-2261's mechanical design places heat-generating parts and active components on the top side of the board, while the onboard and rear I/O are located on the bottom, facilitating more efficient thermal dissipation. Additionally, the MIO-2261 features an optional heat spreader to simplify and improve thermal design. Using a heat spreader to conduct heat to the case cover allows for more compact and lower-profile designs than with a traditional heatsink, while also creating better heat dissipation.
- Strict Testing and Process Criteria: During the design validation stage, Advantech's extended temperature testing evaluates the performance of components or systems under varying environmental conditions. This includes a variety of dynamic burn-in temperature cycles over extended periods, as well as cold power-on and power-off tests. Depending on the requirements, designs must pass testing across a wide temperature range of -40°C to 85°C without any performance degradation or loss of function. This rigorous testing ensures reliable performance in mission-critical applications at extreme temperatures. And during the manufacturing validation stage, each MIO-2261 board must pass the 1005 temperature test before shipment.
Features and Specifications:
- Ultra 2.5" MI/O Series (Pico-ITX Size): 100 x 72 mm (3.9" x 2.8")
- Supports extended temperature range of -40°C to 85°C
- Intel® Atom N2600 1.6GHz / N2800 1.86GHz Dual Core Processors + NM10, DDR3 800/1066MHz up to 4GB
- DirectX 9, MPEG2 H/W Acceleration, H.264 / VC1 / WMV9 (H/W Decoding / Acceleration)
- Independent Dual Display: 18/24-bit LVDS + VGA
- Intel GbE, Rich I/O Interface with 2xCOM, 1xSATA, 4xUSB 2.0, 8-bit GPIO, HD Audio In/Out, SMBus, I2C, mSATA, mini-PCIe Medium size
- mSATA: Supports both mSATA storage and USB interface communication module
- Expanded interface support from MIOe: DisplayPort or HDMI, 2 x PCIe x1, LPC, SMBus, 2 x USB 2.0, HD audio output/input, 5VSB/12VSB
- Supports 12V +/- 10% power input and hot-swappable DC power design
- COM port design with 15KV ESD overhead protection
- TVS (Transient Voltage Suppressor) design on the power input
- Compatible with WinCE7.0, WinXP/XP Embedded, Windows 7, WES7, Linux, and Vxwork OS
- Supports Advantech SUSIAccess and embedded software API and utility
- Thermal solutions: Fanless design on the MIO-2261, as well as with the optional heat spreader solution for clustering, making the whole system more compact.
