The new harsh environment platforms introduced by congatec withstand extreme temperature ranges from -40°C to +85°C, feature BGA-welded processors for shock and vibration, as well as high EMI resistance, and can be optionally available with conformal coating to protect the platforms against condensation, salt water, and dust ingress.
One of the highlights of the presentations was the high-end x86 Computer-on-Modules (COM) for extreme environments, based on the COM-HPC and COM Express standards. The conga-HPC/cTLU COM-HPC Client Size A modules and the conga-TC570 COM Express Compact modules are available with the new 11th generation Intel Core Scalable processors for extreme temperatures ranging from -40°C to +85°C. Both modules are the first to support PCIe x4 Gen 4 performance for connecting peripherals with massive bandwidth.
Congatec's rugged platforms, with extended operating temperature options from -40°C to +85°C, based on Intel Atom x6000E Series, Intel Celeron, and Pentium N & J Series processors, are available as COM modules in SMARC, Qseven, COM Express Compact, and Mini form factors, as well as Pico-ITX single-board computers (SBCs). They are particularly impressive in real-time industrial markets, offering not only increased performance but also Time-Sensitive Networking (TSN), Intel Time-Coordinated Computing (Intel TCC), Real-Time Systems (RTS) hypervisor support, and BIOS-configurable ECC.
The presentation is complemented by the display of the COM SMARC 2.1 module with an i.MX 8M Plus processor. Consuming only 2 to 6 watts, this ultra-low-power embedded computing and edge platform for extended temperature ranges boasts four powerful Arm Cortex-A53 processor cores and an additional Neural Processing Unit (NPU), adding up to 2.3 TOPS of AI computing power. Designed for AI inference and edge machine learning, the modules are also optimized for processing and analyzing data from the dual-camera image signal processor (ISP) received via the two integrated MIPI-CSI interfaces.
The value package includes robust passive cooling options, optional conformal coating for protection against corrosion caused by humidity or condensation, a list of recommended motherboard layouts, and components specifically designed for the extended temperature range to achieve maximum reliability. This set of technical features is complemented by a comprehensive service offering that includes temperature verification, high-speed signal conformity testing, design services, and all the necessary training sessions to simplify the use of congatec embedded systems technologies.
