Heat dissipation is standardized, and all solutions feature a massive, lightweight metal heatsink that quickly and effectively disperses waste heat from CPU hotspots.
Depending on the TDP, the heatsink can be expanded with passive finned heatsinks or active cooling systems. Congatec also offers its three cooling solutions in a standardized height, allowing OEMs to implement identical cooling solutions with comparable TDP requirements in the future. This will make it much easier to scale embedded systems based on 3.5-inch SBCs across multiple processor generations. The first configurations of the new, fully in-house developed cooling solutions are optimized for use with the new conga-JC370 3.5-inch SBCs based on the 8th generation Intel® Core™ processor series (codenamed Whiskey Lake).
“To make it easier for customers to design embedded systems, our strategy has always been to develop customized, ultra-durable cooling solutions for all our form factors. These solutions are standardized and, when cooling is activated, impress with an extra-long MTBF that not only meets but even exceeds all common industry standards. Continuing with this strategy, we have now also developed a new, unique cooling solution for our 3.5-inch SBCs. It differs significantly from conventional 3.5-inch SBCs, where the processor and I/O are on the same side of the board. By mounting our solution on the underside of the board, we create significantly more space for massive cooling systems, while also making system design easier for developers, as the case connection and internal system airflow are standardized,” says Martin Danzer, Director of Product Management at congatec, explaining the advanced cooling concept for the new 3.5-inch SBCs, which utilize almost the entire surface area of the 146mm footprint. × 102 mm.
The three cooling systems, consisting of a heatsink and an optional passive or active heatsink, are designed for 3.5-inch SBCs and have been developed with future processors in mind that will require up to 45 watts of cooling capacity in appropriately limited cTDP modes. The heatsink is mounted on an existing cooling solution. An external system fan is recommended for the passive cooling platform. The active cooling is designed for standalone operation. For easy and flexible system integration, each of the above cooling solutions is available in both threaded and borehole variants.
The active fan-based cooling system, used, for example, in 3.5-inch systems with 25-watt 8th generation Intel® Core™ i7 processors (i7-8665UE / codename Whiskey Lake), is specifically designed for 24/7 operation in harsh industrial environments. In this comprehensive cooling system, the fans are not only mounted more securely but also specifically designed to reduce wear. Furthermore, the bearings are equipped with a special seal and an additional cover to provide maximum protection for the mechanical components and lubricant. Using high-performance synthetic oil as a lubricant, the fan boasts a multi-decade MTBF across the industrial temperature range of -45 to +85°C and offers industrial-grade shock and vibration resistance.
