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- Category: Other Semiconductors
Melexis presents the MLX90397, a 16-bit, 3-axis sensor with a magnetic field range up to 50 mT (with an adaptive range on the z-axis up to 200 mT). Users can select the fields to measure from BX, BY, BZ, temperature, or a combination thereof. The sensor element is based on the proven Triaxis® 3D Hall effect technology. Captured data is converted to digital form and transferred via an I2C interface.
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- Category: Integrated Circuits
Toshiba Electronics Europe GmbH ("Toshiba") has added five new TCK42xG series MOSFET gate driver ICs, suitable for a wide range of applications, including battery-powered, consumer, and industrial equipment. These devices control the applied gate voltage independently of the input voltage and feature overvoltage protection.
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- Category: Encoders
TWK's new ABN encoder model has a resolution that divides the full 360° circle into more than 4 million steps. To be precise, it divides into 222 steps, which equates to a 22-bit resolution. This high accuracy is greater than ±10 arcseconds, or less than ±0.003°. This allows for precise measurements of positions and speeds up to 10,000 rpm.
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- Category: Current Affairs
Salicru will be present at the next edition of the Genera energy and environment trade fair, which will be held in Madrid from June 14 to 16. They will be showcasing the latest additions to their portfolio of photovoltaic solutions for self-consumption and energy efficiency.
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- Category: Liabilities
SMP Sintermetalle Prometheus GmbH & Co KG (SMP) offers inductive components for environmental engineering applications. These components are used in converters, power converters, and high-frequency converters, which are employed in waste and raw material recycling plants, waste treatment plants, and wastewater treatment plants.
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- Category: Design
The first royalty-free RISC-V-based FPGA (Field Programmable Gate Array) SoC with an open ISA (Instruction Set Architecture) has reached mass production, marking a significant milestone in the evolution of embedded processors. Given the rapid customer adoption of PolarFire® FPGA SoCs,
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- Category: Current Affairs
Digi-Key Electronics has enhanced its myLists tool to now include price quotes, improving order efficiency.
myLists is a modern parts list management tool that consolidates bills of materials (BOMs), price and availability lists, and quotes.
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- Category: Integrated Circuits
Mouser Electronics, Inc. now has UnitedSiC's (now Qorvo®) 1200V UF4C and UF4SC silicon carbide (SiC) FETs in stock. This family of fourth-generation devices, part of the high-performance SiC FET line, offers considerable figures of merit in terms of on-board endurance for use in power solutions on conventional 800V bus architectures in applications such as EV on-board chargers, industrial battery chargers, industrial power supplies, DC-DC converters, solar inverters, and more.
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- Category: Encoders
CUI Devices' Motion division today announced the introduction of a new series in its AMT incremental encoder family. Based on the existing AMT11 series package, the new AMT11A series is not subject to silicon-related lead time constraints and can serve as a direct replacement for AMT11 encoder models.
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- Category: Other products
With the EC frameless DT, maxon presents a solution that has much to offer: thanks to its frameless design, these brushless motors can be easily integrated into a wide variety of applications. They reach their full potential wherever the most stringent requirements for dynamics, torque, and power density are met.
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- Category: Other Semiconductors
Renesas Electronics Corporation has introduced the RZ/T2M high-performance motor control microprocessor units (MPUs) for applications such as AC servo drives and industrial robots. The RZ/T2M combines fast, highly accurate, real-time motor control capabilities with the latest Industrial Ethernet on a single chip, while also supporting functional safety operation.
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- Category: Current Affairs
Vicor has celebrated the opening of its new, state-of-the-art power module manufacturing facility. The first ChiP™ (Converter housed in Package) production plant enables more scalable, automated, and cost-effective power module manufacturing to support customers worldwide.
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