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Farnell has announced its second annual Women in Engineering Survey in collaboration with the element14 community. The survey is an opportunity for women in the engineering field to share their perspectives and experiences to shed light on their career development, challenges, and overall opportunities within the electronics engineering industry.
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According to IDC's Worldwide Semiconductor Technology and Supply Chain Intelligence report, global semiconductor revenues will reach $661 billion in 2022, representing a year-on-year growth rate of 13.7% following the strong results of 2021, when revenues reached $582 billion.
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Farnell has strengthened its worldwide alliance with Toshiba Electronics Europe GmbH, which represents a significant expansion of its product range and stock. The range of Toshiba products available at Farnell will reach 800 devices and will increase to more than 1000 products in 2023 in parallel with the introduction of new products starting this year.
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The THERMOBAT project (A Ferrosilicon Latent Heat Thermophotovoltaic Battery), coordinated by researchers from the Institute of Solar Energy of the Polytechnic University of Madrid (IES – UPM), has been one of the 4 selected in the Energy harvesting and storage technologies challenge of the European Innovation Council Transition to Innovation 2021 call, which is part of the European Framework Programme for R&D&I Horizon Europe.
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Single-chip microcontrollers for embedded control and computational functions are ubiquitous and continue to be designed into more systems. Much of the new growth in MCUs is driven by embedded automation and the expansion of sensors. The ubiquity of MCUs was a key factor in why vendors were unable to sustain the strong rebound of 2021 following the global recession of 2020 caused by the onset of the Covid-19 pandemic.
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The Standards Group for Embedded Technologies (SGET) announces two important new milestones for its Open Standard Module (OSM) specification: First, the release of OSM version 1.1, which offers numerous backward-compatible enhancements and future-proof extensions. Second, the release of the first OSM design guide, which provides practical advice and information on designing this second-generation Computer-on-Module (COM) Gen2 standard, essential for OEM customers. The OSM standard specifies machine-solderable COM modules.
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Last Tuesday, June 7, the European Parliament and the Council reached a political agreement to require, as a matter of course, that electronic devices distributed in the European Union be compatible with USB Type-C chargers. The new regulation, which will involve amending an EU directive, will be ratified and will come into force two years after its publication, presumably in the autumn of 2024.
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Christie® has expanded and modernized its production facilities at the Center for Engineering Excellence in Kitchener, Canada, to meet the growing demand for MicroTiles® LED. The new space triples manufacturing capacity thanks to its state-of-the-art assembly line and robotic operation.
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Yamaha Motor Robotics' FA division will demonstrate how industrial robots work together autonomously to increase productivity and reduce waste, at booth no. 314 in hall B5 at Automatica 2022 in Munich, from June 21 to 24.
AEWIN partners with Blaize to deliver high-performance GSP computing for AI applications at the edge
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Blaize, the AI computing innovator revolutionizing edge computing and automotive solutions, has announced that AEWIN Technologies, Taiwan, is offering its SCB-1932 multi-access edge computing network appliance platform with the Blaize® Xplorer X1600P-Q PCIe edge computing AI accelerator.
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Mouser, in collaboration with ROHM Semiconductor, announces a new eBook focused on efficient components and technologies for use in low-power solutions for industrial Internet of Things (IoT) applications.
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Mouser has signed a new distribution agreement with Innodisk, a supplier of industrial embedded flash and DRAM storage products and technologies, focused on the enterprise, industrial, medical and aerospace sectors.
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