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Allegro MicroSystems and UMC sign a long-term foundry agreement
Allegro MicroSystems (Allegro) and United Microelectronics Corporation, a semiconductor foundry, have signed a long-term agreement for UMC to continue as the main manufacturer of Allegro's foundry wafers.
The agreement covers technical collaboration and establishes UMC's capacity for Allegro's proprietary automotive technologies, supporting Allegro's strong long-term growth projections. The two companies previously established an agreement in 2012 that initiated the transfer and production of Allegro's proprietary technologies at UMC's manufacturing facilities.
“We wanted a partnership that would help us expand Allegro’s business and portfolio. UMC has been extremely successful in meeting our customers’ technology, quality, and production needs,” said Thomas Teebagy, senior vice president of Operations and Quality. “UMC has the capability and technology to accommodate Allegro’s projected growth and increased wafer shipping requirements.”.
Allegro has previously transferred its ABCD4 and ABCD6 processes to UMC and will continue to transfer its own processes under the new agreement. Currently, the two companies are developing the Allegro A10S and A10P 0.18µm BCD technologies, as well as compatibility with advanced GMR/TMR silicon integration.
Bruce Lai, Vice President of Operations at UMC, commented, "UMC's sustained effort toward developing robust, specialized automotive technologies has enabled us to become a leading foundry in the production of automotive integrated circuits, with AEC-Q100 qualified processes, supported by manufacturing that meets the rigorous ISO TS-16949 automotive quality standards at all UMC facilities. We value our long-standing partnership with Allegro in producing their automotive ICs and are pleased to expand our cooperation through this new agreement to support their future growth requirements and help enhance their market position."
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