The goal of this collaboration is to combine Nexperia's expertise in SiC semiconductor technology with Semikron Danfoss's cutting-edge capabilities in power module encapsulation and integration. Together, the companies aim to assess how a joint approach can enable scalable, high-performance solutions for next-generation electric vehicles.

SiC technology plays a fundamental role in improving the efficiency, power density, and performance of electric drive systems. By combining complementary expertise across the entire value chain—from chip to module—companies aim to develop optimized solutions tailored to the demanding requirements of automotive applications.

As part of the collaboration, both companies will explore joint engineering approaches, including early integration and joint design, to unlock the full performance potential of SiC-based systems. Carsten Götte, Senior Vice President of Semikron Danfoss’s Automotive Power Module Division, said: “By combining Nexperia’s advanced semiconductor technology with our module expertise, we see great potential to achieve more together than either company could on its own. We look forward to exploring how this collaboration can create added value for our customers in the rapidly evolving electric vehicle market.”

Edoardo Merli, Senior Vice President and Head of the Wide Bandgap, IGBT & Modules (WIM) Business Group at Nexperia, stated: “Strong partnerships are essential to unlocking the full potential of wideband technologies, including SiC and GaN. With our ongoing investments in R&D and our strong focus on collaboration from the earliest stages, we actively drive the alignment of semiconductor and system requirements from the outset. We are excited to explore how this partnership with Semikron Danfoss, a global leader in power electronics, can advance our module offering.”