In addition to the standard liquid cooling solution with an adjustable fan system, you can select additional effective options, designed specifically for large and massive circuit boards, such as the extended Power Cooling Unit or an under-cooling system. For more consistent cooling, Rehm has also designed the first waterless reflow soldering system, which operates using a liquid nitrogen cooling system. Find the cooling solution that best suits your production process!
The VisionX series utilizes a classic two- to four-stage cooling section, depending on the system. This is an active cooling process, cooled with water via heat exchangers within an efficient closed-loop system. Process air is cooled in the heat exchangers and flows from the top of the unit. The air is then drawn downwards, cleaned through a filter system, and made available again for the cooling process. The fans can be individually adjusted by zone, allowing precise control of the cooling process and thus influencing the cooling gradient. This enables the component to be cooled without stress to below -50°C, even with lead-free solder. The filters in the cooling section are easy to clean. They are replaced at the rear of the system using the change insert. This does not even require opening the process chamber.
Flexible cooling section options
• Stress-free cooling thanks to adjustable fans in classic cooling zones
• Gentle component cooling via a Power Cooling Unit as an extended cooling section
• Optimal cooling of large and massive boards via additional bottom cooling
• Flexible combination possibilities of different options
• Innovative constant cooling principle using liquid nitrogen cooling
Smooth Cooling: Power Cooling Unit as an Extended Cooling Section.
Cooling complex components requires a controllable cooling system that meets the specific requirements of these electronic components. In addition to our highly regarded standard cooling section, we can extend the cooling zones with a Power Cooling Unit. In this case, cool air flows from above onto the board, allowing for even more intensive and gentle cooling thanks to the expanded process. The Power Cooling Unit can be implemented as an extension of the standard cooling zones under a nitrogen atmosphere or as a separate module for materials resistant to higher cooling power in an air atmosphere.
Powerful: Bottom Cooling for Large, Heavy-Duty Boards.
For large or heavy components, standard cooling power is sometimes insufficient to achieve the desired output temperature. With bottom cooling, the VisionXP+ effortlessly achieves efficient cooling of heavy-duty boards. Cool process air is blown evenly from the top and bottom of the board, enabling a particularly homogeneous cooling process and reducing stress on the material. Fan speeds can be flexibly adjusted for each assembly. Due to the low output temperatures, an additional cooling system, such as a fan-assisted output conveyor, is not required. Assemblies with uneven copper layer distribution are especially protected against warping and bulging thanks to bottom cooling.
Durable: Liquid Nitrogen Cooling.
In collaboration with Air Liquide partners, Rehm Thermal Systems has developed an innovative cooling principle for more efficient use of the nitrogen required for inerting and has designed the first waterless reflow soldering system using nitrogen cooling. Cryogenic liquid nitrogen (-196 °C) transmits the cold within the system's cooling section, vaporizes, and is then used in its gaseous state for inerting. This provides the system with both the necessary cooling and an inert atmosphere. This eliminates the need for re-cooled water, including the refrigeration unit and the refrigerant, which previously required more energy. This results in annual savings of approximately 17 tons of CO2 and 30,000 kWh per system. With this sustainable concept, Rehm also impressed this year at the Baden-Württemberg Environmental Technology Award, taking 2nd place in the "Energy Efficiency" category.
