The result is an effective thermal interface between the heat sinks and the electronic devices, even when there are irregular surfaces, air gaps or surface textures.
Typical uses of the 70TP THERM-A-GAP™ PAD range from telecommunications equipment and PC boards to chassis applications, thermally enhanced BGAs (ball grid arrays), memory packages and modules, GPU and CPU applications, and a host of industrial devices.
These applications and many more will benefit from the thermal properties of the 70TP THERM-A-GAP™ PAD, which include a thermal impedance of 0.27 °C-in/w (at 10 psi, 1 mm thick) and a thermal capacity of 0.72 J/gK.
The product also offers a volume resistivity of 10¹³ ohm-cm, along with low deflection force and minimal oil bleed. The latter is important because it minimizes the buildup of oil on the substrate or heat sink surface during use. Oil bleed in comparable products on the market can reduce electrical performance in the form of lower surface resistance and breakdown voltage. Furthermore, impurities and particles from the environment can be absorbed into or adhere to the oil, compromising the product's performance and lifespan.
Parker Chomerics manufactures the 70TP THERM-A-GAP™ PAD to order, making it easy to apply to the desired component. A fabric-backed version is available for improved tear resistance and easier handling. Suitable for use in a wide operating temperature range of -55 to +200 °C, the new RoHS-compliant gap filler pads are available in standard thicknesses from 0.76 to 5.0 mm.
