This unique construction utilizes a combination of thermally conductive resin between the ceramic and copper on the cold side of the module, high-temperature soldering, and larger P/N elements made of premium silicon. The elasticity of arcTEC's resin layer allows for thermal expansion and contraction during the repeated heating and cooling of normal operation, reducing stress on the elements and resulting in improved thermal contact, superior mechanical bonding, and negligible performance degradation over time. The high-temperature soldering and larger silicon elements are incorporated to enable faster and more uniform cooling.

The CP20H, CP30H, CP39H, CP60H, and CP85H series utilize the 15 mm to 40 mm arcTEC structure, with profiles as thin as 3.1 mm. These thermoelectric modules are available with a ∆Tmax of 77°C (Th=50°C) and current ratings ranging from 2.0 A to 8.5 A.
Thanks to their reliable solid-state construction, precise temperature control, and quiet operation, these thermoelectric coolers are ideal for high-density, high-power medical and industrial applications, as well as for cooling and sealed environments where forced cooling is not feasible.

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