As a two-component, liquid, and meterable material, Gap Filler 1500LV remains stable at high temperatures, significantly reducing outgassing and thus preventing fogging, while providing the low modulus of elasticity typical of silicone materials. With a thermal conductivity of 1.8 W/mK, efficient heat management is ensured for applications with varying power levels.
Furthermore, it features a longer working time, up to two hours at 25°C after mixing the two components of Gap Filler 1500LV, and a curing time of 8 hours at room temperature or 10 minutes at 100°C.
Like other components in the Bergquist: Gap Filler family, Gap Filler 1500LV exhibits good thinning under shear stress for optimal metering, excellent impregnation capacity, and adheres to the target surface, maintaining its shape. This allows for flexibility in component orientation during assembly. Its optimal adaptability minimizes mechanical stress on the components and allows for filling any type of cavity or gap to eliminate air voids. Gap Filler 1500LV has a low level of adhesion, making it suitable for applications where high bonding strength is not required.
- Details
- Category: Thermal control
Low-volatility, dosable thermal interface material optimized for LED applications
Bergquist Company introduces Gap Filler 1500LV, the first in a new series of dosable, low-volatility thermal interface materials optimized for LED applications, where the phenomenon of lens and optic fogging must be minimized.
Print Magazine
Annual subscription price:
You will receive all 10 editions that are published each year.
social networks
Popular News Electronics
Spanish electronics magazine. Printed for over 25 years.
Spain - Madrid - All rights reserved © Convertronic Professional Spanish Electronics Magazine.