These materials are used to manage the enormous amount of heat generated by the semiconductors in gaming consoles, thus ensuring their performance and reliability. The sophisticated features of modern gaming platforms cause electronic components to reach very high temperatures. This can negatively impact the user experience, as the processor slows down, unexpected system shutdowns occur, or, in the most severe cases, it can lead to permanent damage to the device and data loss.
New gaming devices utilize Accelerated Processing Units (APUs), which are sophisticated systems of electronic components that integrate modern multi-core processors with ultra-fast graphics accelerators and dedicated memory modules. However, this design generates a significant amount of heat that must be managed to maintain optimal console performance throughout its lifespan.
Honeywell is a renowned leader in the development of thermal management solutions, which transfer and dissipate the heat generated by these advanced semiconductors. Honeywell's proven PTM series of thermal management materials enables processors to maintain high performance even under the most demanding conditions. This series is based on a sophisticated chemical phase-change process specifically developed for high-performance semiconductor devices. Honeywell's industry-leading TIM technology transfers thermal energy from the APU to the heatsink and fan module. This connection is crucial, as it keeps the APU cool while allowing the heatsink to operate optimally.
Honeywell's proprietary formulation provides long-lasting chemical and mechanical stability, which has been rigorously tested in accelerated aging conditions, including prolonged baking at 150°C, thermal cycling between -55°C and +125°C, and the Highly Accelerated Stress Test (HAST). This stability makes it possible to maintain consistently high thermal performance, even long after other thermal interface materials have broken down or dried out due to heat.
Honeywell Electronic Materials, part of Honeywell Performance Materials & Technologies, supplies microelectronic polymers, electronic chemical compounds, and other advanced materials, in addition to a broad portfolio of products from its metals business segment, such as coil assemblies and physical vapor deposition (PVD) coatings, precious metal thermocouples and anodes for low-alpha emissivity coatings, and advanced heat-diffusing materials used during final packaging processes for electrical interconnects and thermal control.
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- Category: Thermal control
Honeywell's PTM series of thermal interface materials selected for a new gaming platform
Honeywell has announced that its PTM series of Thermal Interface Materials (TIM) has been selected as the thermal control solution for a major gaming platform.
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