The internal temperature of an enclosure can be reduced by channeling filtered cool air from the outside into the enclosure or by expelling hot air from within. The resulting airflow prevents the formation of air pockets and protects electronic components from overheating.
Thanks to "AIR FLAP" technology, the Filter Plus Fan achieves much more effective air circulation and delivers a higher airflow. This results in a significant increase in cool air entering the enclosure. At the same time, hot air is expelled more efficiently and quickly to the outside.
The new Filter Plus Fan series comprises five cutout sizes, from 92 x 92 mm to 291 x 291 mm. Depending on the application, two systems are available: FPI and FPO. Costs are reduced with its single filter mat. A rack and pinion tightening mechanism is used for mounting, providing high reliability and a secure fit.
- Details
- Category: Thermal control
STEGO Filter Plus Fan
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