Hackers are becoming increasingly sophisticated, making it essential for system designers to apply robust security principles to their product development. Developed and endorsed by industry experts from the Trusted Computing Group (TCG), DICE is a simple and reliable method that can be implemented in the hardware of security products during manufacturing. The architecture separates the boot process into layers, creating unique secrets and an integrity measure for each layer, automatically changing keys, and protecting secrets if malware is present. One of the main advantages of using secure boot functions in the CEC1702 with the DICE standard is that it allows equipment manufacturers to create a chain of trust for multiple firmware loads, which is especially important for customers concerned about authenticating system-critical instructions, for example, in applications such as power plants or online server databases.
“Designing and implementing secure devices remains a significant challenge for developers,” said Ian Harris, vice president of Microchip’s computing product group. “Implementing security with DICE gives designers confidence that their device’s fundamental security is based on principles developed and reviewed by industry experts. Along with the DICE architecture, the CEC1702 incorporates numerous features and provides a simple way to add the crucial security and privacy features required by embedded systems.”.
Time and ease of use are paramount considerations for designers developing cloud-connected solutions. The CEC1702 IoT development kit with the DICE architecture helps designers streamline their development cycles. The kit comes with a powerful 32-bit ARM® Cortex®-M4 programmable controller and sample code for rapid development of a secure, cloud-connected solution. Microsoft Azure certification allows customers to develop their product with the confidence that the components required for internet connectivity have been reviewed and certified.
“IoT security threats continue to grow, and customers can turn to Microchip’s IoT development kit to quickly and easily connect devices to the cloud and incorporate DICE security standards into their product,” said Sam George, director of Microsoft Azure IoT at Microsoft Corp. “The development kit allows customers to implement the DICE standard on a device’s hardware and take advantage of Microsoft Azure’s security and privacy features.”.
development tools
simplify the addition of authentication and cryptography to connected devices with the CEC1702 IoT Development Kit. Key features of the kit include:
• CEC1x02 development board with a Plug-in Module (PIM) containing the CEC1702 with integrated cryptographic accelerators, reducing code and time to market
• Two power strips compatible with MikroElektronika's extensive range of click boards™ to enable flexible design requirements
• MikroElektronika Wi-Fi® 7 click board, incorporating Microchip's ATWINC1510-MR210PB IEEE 802.11 b/g/n module, optimized for low-power IoT applications
• MikroElektronika THERMO 5 click board, capable of measuring temperatures on four channels within a range of 0 to 127 °C and an extended range of -64 to 191 °C
Availability
The CEC1702Q-B2-I/SX and the CEC1702 IoT development kit are now available.
Pricing
The price of the CEC1702 IoT development kit is $199.99.
