Furthermore, the product conforms to the standard 0.35 mm solder pitch to streamline mass production using common surface mount technology (SMT) processes. Reliable and robust performance is ensured by internal shielding and an insert-molded power pin, which protects the pins from potential damage during high-volume manufacturing and assembly. These features, along with wide alignment, facilitate easy and secure mating, as well as low detachment rates. These patent-pending connectors offer product developers and device manufacturers greater freedom and flexibility to deliver compact form factors, making them ideal for augmented reality/virtual reality (AR/VR), automotive, communications, IoT, medical, and wearable applications.
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Mole Quad-Row Board-to-Board Connectors
Mouser now has Molex Quad-Row board-to-board connectors in stock. These board-to-board connectors feature a staggered circuit layout and a low-profile design with a 0.175 mm pitch, saving 30% of space compared to conventional connectors. The connectors meet the 3.0 A standard, enabling high power delivery in a compact form factor.
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