Furthermore, if customer requirements change during the project, it further increases development time, impacting the entire project.
With the scalable and modular xEVCap, TDK aims to help inverter designers meet the variable requirements that may arise during project execution (e.g., capacity, current, geometry, etc.), saving significant re-engineering time. This approach also reduces overall costs by using standardized modules, minimizing the variety of components in stock and engineering costs. To meet different capacity and current requirements, multiple xEVCaps can be easily connected in parallel via a laminated busbar. The entire product range complies with the automotive standards AEC-Q200 rev. E and IEC TS 63337:2024.
The xEVCap is available in two terminal versions: the B25654A001 has pins for soldering to laminated busbars or PCBs, while the B25654A002 has flat terminals for soldering or screwing to those busbars. Each variant is available in multiple mechanical versions and different voltage ratings. The mechanical dimensions are 85 x 47 x 40.5 mm (L x W x H), 97.5 x 35.5 x 42.5 mm, and 109 x 47 x 40.5 mm. The voltage ratings are 500 V, 650 V, 850 V, and 920 V. Depending on the voltage rating, the capacitance ranges from 60 µF to 270 µF. All xEVCaps are included in TDK's CLARA (Capacitor Life And Rating Application) tool, which simulates the components electrically and thermally under various operating conditions. The STEP files and SPICE models of the components are available for download.
The applied voltage can exceed the rated voltage for a limited time. For example, the 850 V types can withstand 890 V for 100 hours at +105 °C and surge voltages up to 1200 V. Rated currents range from 35 A to 60 A (at 10 kHz) with ESL values of 14 nH for a single capacitor. When connected in parallel, these inductances are extremely low, meeting the requirements of wideband semiconductor (WBG) switching systems. The operating temperature range is -40 °C to +105 °C.
