Complementing the two features mentioned above, reliable 3D solder joint inspection also plays a crucial role, distinguished by its dependability with systems like Viscom's new iS6059 PCB Inspection Plus. Featuring nine views at best-in-class resolution with 26% more pixels, variable illumination, larger angular field-of-view sizes at the same resolution, new data transfer speed increases combined with 25% faster image capture, and extensive networking options, it provides a solid foundation for unsurpassed on-line performance. The iS6059 PCB Inspection Plus offers advanced inspection methods to fully automate the verification of whether the solder joint of even the smallest electronic component is normal or too thin, regardless of short cycle times. Another 3D AOI system on display at the Viscom booth is the S3088 ultra chrome, which is currently in successful use worldwide, making it a workhorse for the company. It will be presented in combination with the latest intelligent handling and verification, which now also offers new forms of assistance with artificial intelligence.
AI is currently a key focus at Viscom. It is also used to measure gaps in solder joints as part of X-ray inspection and to rule out defects due to individual factors. Viscom systems, such as the iX7059 PCB Inspection XL, detect these and other types of hidden defects. Viscom offers high-performance inline 3D X-ray systems for a wide range of products, from flat assemblies up to 1,600 mm in length to compact, solid objects weighing up to 40 kg. Due to its enormous international success, the combined X7056-II 3D AXI/3D AOI system will also be presented. The special features of manual and semi-automatic X-ray inspection will be demonstrated on the MXI X8011-III 3D system.
