Embedded Systems
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RECOM has released a connection board for connecting STMicroelectronics' SensorTile to RECOM's R-78S evaluation board. This technology allows the SensorTile to draw a stable 3.3V from an AA battery down to voltages as low as 0.65V. Therefore, engineers can integrate a high-capacity, single-cell AA battery into their designs and use test points to estimate the application's lifespan.
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HMS Industrial Networks introduces the M.2 form factor to its IXXAT® INpact PC card range. The result is the smallest PC interface for Industrial Ethernet and Profibus on the market for compact control systems and mobile devices
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Congatec presents its new COM (Computer-on-Module) model conga-TS370 COM Express Type 6, in parallel with the launch of the 8th generation Intel Xeon and Intel Core Embedded processors (codename Coffee Lake H).
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Mouser Electronics, Inc., has made available the AAEON UP Squared Grove IoT development kit. Designed as a modular, ready-to-use toolkit optimized for ease of use, the kit combines a custom Ubuntu 16.04 LTS operating system and end-to-end tools to reduce development time and provide a high-performance development platform for computer vision, machine learning, and data aggregation applications.
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Congatec presents its first embedded MIPI-CSI 2 x86 kit that facilitates the integration of embedded vision technology into intelligent transport control points, access control systems and ticketing systems.
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Würth Elektronik eiSos and Infineon Technologies AG offer a 200 W development system for wireless power transfer under the designation 760308EMP-WPT-200W. The development kit is notable for the fact that the connection between the transmitter and receiver coils can be used for both power and data transmission.
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Mouser Electronics, Inc. is stocking the Renesas Electronics Synergy AE-CLOUD1 Application Sample Kit. Containing all the necessary hardware, firmware, and software to develop cloud-connected applications, the kit allows engineers to connect to the Renesas IoT Sandbox, a free prototyping environment, where they can create prototypes and evaluate cloud-based developer accounts and editable application samples.
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RS Components (RS), a trading brand of Electrocomponents plc, announces the availability of the latest Raspberry Pi computer board: the Raspberry Pi 3 Model B+. Building on the success of the Raspberry Pi 3 Model B, which will continue to be produced, the new board is the latest product in the Raspberry Pi 3 range and is aimed at a wide spectrum of users, from students and hobbyists to experienced engineers and professionals developing innovative Internet of Things (IoT) applications.
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Farnell element14 introduces the Raspberry Pi 3 Model B+, the fastest and most powerful version yet, refining the Raspberry Pi 3 Model B. Built on the foundation of a new 64-bit quad-core Broadcom BCM2837 application processor running at 1.4 GHz, the Raspberry Pi B Model B+ is over 15% faster than the Raspberry Pi 3 Model B.
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congatec and Luxoft present a next-generation automotive platform with COM SMARC 2.0 modules. Launched with the conga-SA5 as the first official compatible module, the Automotive Reference Platform (ARP), jointly developed by Intel and Luxoft, makes next-generation vehicle cockpit digital designs smarter.
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Mouser Electronics, Inc. has available the Cypress Semiconductor EZ-BT™ WICED Dual Mode Module Evaluation Board and EZ-BLE™ WICED Module Evaluation Board.
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- Category: Embedded Systems
The G40A is a high-performance, low-power, multi-core CPU platform based on an ARM Cortex A72 processor. Being fully virtualized, it was designed for communication-intensive applications in harsh environments that require high data bandwidth and computing performance, such as data collection applications on board trains, industrial applications, or heavy-duty vehicle applications.
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