Built on Intel’s 10nm SuperFin technology in a two-package design with dedicated CPU and platform controller hub (PCH), the new flagship COM-HPC Client and COM Express Type 6 modules impress with a new bandwidth benchmark of up to 20 PCIe Gen 4.0 lanes for massive IIoT gateway and real-time intelligent edge computing workloads. To handle these massive workloads, the new modules feature up to 128GB of DDR4 SO-DIMM RAM, integrated AI accelerators, and up to 8 high-performance CPU cores, achieving up to a 65% [1] increase in multi-threaded performance and up to a 32% [2] increase in single-threaded performance. Furthermore, graphics-intensive visualization, audio, and audio workloads are enabled with up to a 70% boost compared to their predecessors [3], further enhancing the performance of these immersive experiences.
The flagship applications that directly benefit from these GPU enhancements are in surgery, medical imaging, and eHealth, as congatec's new platform supports 8K HDR video for optimal diagnosis. Combined with the platform's AI capabilities and the comprehensive Intel OpenVINO™ toolkit, clinicians can easily access and gain insights from deep learning-based diagnostic data. But this is just one of the advantages of the integrated Intel UHD Graphics, which also support up to four 4K displays in parallel. Furthermore, it can process and analyze up to 40 1080p/30fps HD video streams in parallel to deliver 360-degree views in all directions. These massive, AI-infused vision capabilities are also important for many other markets, such as factory automation, machine vision for quality inspection in manufacturing, safe spaces and cities, as well as collaborative robotics and autonomous vehicles in logistics, agriculture, construction, and public transportation, to name just a few.
AI inference and deep learning algorithms can run seamlessly in massive parallel on the integrated GPU, or on the CPU with built-in Intel® Deep Learning Boost that combines three instructions into one, accelerating inference processing and situational awareness.
The new COM-HPC Client and COM Express Type 6 platforms feature built-in security functions that are critical for the fail-safe operation of many mobile vehicles and robots, as well as stationary machinery. Since real-time support is mandatory for these types of applications, congatec modules can run RTOSs such as Real-Time Linux and Wind River VxWorks, and provide native support for Real-Time Systems' hypervisor technology, which is also officially supported by Intel. The result for customers is a truly complete ecosystem package with the most comprehensive support possible. Other real-time capabilities include Intel® Time Coordinated Computing (Intel® TCC) and Time Sensitive Networking (TSN) for real-time connected IIoT/Industry 4.0 gateways and edge computing devices. Enhanced security features that help protect systems against attacks make these platforms ideal candidates for all types of mission-critical customer applications in factories and utilities.
The feature set in detail:
The conga-HPC/cTLH COM-HPC Client B-size modules (120mm x 120mm) and the conga-TS570 COM Express Basic Type 6 modules (125mm x 95mm) will be available with the new 11th Gen Intel® Core™, Xeon®, and Celeron® Scalable processors, with select variants even for extreme temperatures ranging from -40 to +85°C. Both form factors support up to 128GB of DDR4 SO-DIMM memory with 3200 MT/s and optional ECC. For connecting high-bandwidth peripherals, the COM-HPC modules support 20 PCIe Gen 4 lanes (x16 and x4), and the COM Express versions support 16 PCIe lanes. Additionally, designers can take advantage of 20 PCIe Gen 3 lanes with COM-HPC and 8 PCIe Gen 3 lanes with COM Express.
To support ultra-fast NVMe SSDs, the COM-HPC module provides a PCIe x4 interface to the motherboard. The COM Express board even has NVMe SSDs onboard for optimal utilization of all the native Gen 4 lanes supported by the new processor. Additional storage devices can be connected via 2x SATA Gen 3 ports on the COM-HPC board and 4x SATA ports on the COM Express board.
While the COM-HPC module offers the latest 2x USB 4.0, 2x USB 3.2 Gen 2, and 8x USB 2.0 ports, the COM Express module offers 4x USB 3.2 Gen 2 and 8x USB 2.0 ports in accordance with the PICMG specification. For networking, the COM-HPC module offers 2x 2.5 GbE, while the COM Express module runs 1x GbE, both supporting TSN. Audio is provided via I2S and SoundWire in the COM-HPC version, and HDA in the COM Express modules. Comprehensive board support packages are provided for all leading RTOSs, including Real-Time Systems hypervisor support, as well as Linux, Windows, and Android.
The two COM-HPC and COM Express Basic Type 6 modules based on 11th generation Intel® Core™, Xeon® and Celeron® processors are available in the following options:
More information about the new conga-HPC/cTLH COM-HPC Clientmodule
conga-TS570 COM Express Basic Type 6 module
Learn more about 11th generation Intel Core processors (formerly Tiger Lake H)
