They all need new embedded platforms, often with real-time capabilities. And they want to be able to control these new platforms remotely with zero downtime to enable a whole new generation of smart mobile and stationary devices. congatec addresses these needs with a series of recently launched COM modules. Designed specifically for industrial-grade edge devices, they enable out-of-band management via IP connectivity, even when the devices are offline.
 
“The most important thing for OEMs and embedded system design houses right now is the congatec modules based on Intel Core processors that support extended temperature ranges, making them a perfect fit for all outdoor equipment – ​​whether mobile, portable, or stationary. The latest congatec modules with soldered RAM also offer significant advantages, as they are qualified for applications exposed to extreme shock and vibration. All modules offer the opportunity to deploy real-time connected OTA (Over The Air) services with TSN capability and Device2x communication. In addition, we also offer virtual machine deployments to enable different tasks and domains on a single device,” explains Martin Danzer, Director of Product Marketing at congatec, adding: “The target platforms, on which our customers can realize their 5G strategies, range from high-end edge servers to low-power client platforms.”
 
 
COM-HPC: The New Standard for Innovators.
Two new module families based on the brand-new COM-HPC specification currently offer the greatest innovation potential for customers: The COM-HPC Client conga-HPC/cTLU and conga-HPC/cTLH modules, based on 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, are designed for the most demanding IoT gateway and edge computing applications requiring the highest bandwidth with up to 20 PCIe Gen 4 lanes. A congatec starter kit is available for both module families, enabling instant application development. The starter kit includes the conga-HPC/EVAL-Client motherboard, which is based on the ATX form factor. This is highly efficient, as engineers can use standard PC components for their embedded system designs. More information
 
on COM Express:
Another highlight for 5G platform designs is congatec's broad COM Express portfolio, which offers the latest processor performance enhancements across the entire feature set. The brand-new conga-TS570 COM Express Type 6 modules, based on the new Tiger Lake H processors, set a new benchmark for massive workloads in real-time connected IIoT gateways, edge computing, and microservers. For demanding transport and mobility applications requiring high-performance computing in an ultra-rugged form factor, the new modules based on 11th Gen Intel Core processors are an ideal complement, supporting extreme temperature ranges from -40°C to +85°C. For 24/7 connected embedded systems without forced ventilation, the compact conga-TCV2 COM Express modules based on AMD Ryzen Embedded V2000 processors are another attractive option. Visit https://www.congatec.com/en/technologies/com-express/ to see the full range of COM Express platforms for 5G connected devices.
 
Small Form Factors:
Congatec’s latest low-power performance modules are ideally suited for 5G-connected, solar-powered distributed process controls in smart energy grids, remote rail and track systems, connected autonomous vehicles, and outdoor mobile equipment with limited battery capacity. Flagship Time-Sensitive Networking (TSN) compatible processors include Intel Atom x6000E Series, Intel Celeron and Pentium N and J Series (codenamed “Elkhart Lake”) processors in the SMARC, Qseven, COM Express Compact, and COM Express Mini Computer-on-Module standards, as well as Pico-ITX single-board computers (SBCs).
 
The configuration of the TSN-supported design for 5G-connected real-time devices was achieved using congatec's demonstration system for workload consolidation. Designed in collaboration with Intel and Real-Time Systems, and certified by Intel as a production-ready unit, this platform integrates three pre-configured virtual machines to demonstrate how multiple tasks can be executed on a single platform with complete determinism, even while one virtual machine is booting. The 5G-enabled platform targets collaboration systems and is pre-configured to include vision and AI to enhance situational awareness.
 
Edge Data Center Power:
For OEMs requiring 5G-connected edge server-level computing power, congatec's COM Express Type 7 modules based on AMD EPYC 3000 Embedded processors support up to 16 cores. Multiple cores further expand workload consolidation options using virtual machines based on Real-Time Systems' hypervisor technology. Since the EPYC 3000 Embedded processors consume up to 100 watts TDP, congatec has also designed suitable cooling solutions, making system integration of these high-end embedded platforms a breeze.
 
The flagship ARM Cortex
SMARC and Qseven modules, based on NXP i.MX 8 processor technologies, complete the 5G platform offering. In this case, congatec focuses on the latest NXP i.MX 8M Plus processor. With machine learning and deep learning capabilities, the new ultra-low-power SMARC and Qseven modules enable applications to see and analyze their environment for situational awareness, visual inspection, identification, surveillance and tracking, as well as touchless machine operation based on gestures and augmented reality. The technology is ideally suited for electric vehicle charging (e-charging) infrastructures that require load balancing logic for multiple distributed charging stations and 5G connectivity for payment, services, and management. TSN compatibility is a given for all these platforms.

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