It offers 8-core processing capabilities under a 45Watt TDP, with excellent Intel Iris Xe graphics and a ready-to-use Edge AI Suite software toolkit, making the SOM-5883 an ideal solution for medical applications with image processing and AI.
To handle the heavy workload of image processing applications, the SOM-5883 is designed to support up to 128GB of DDR4 3200 SODIMM memory, featuring high-capacity paired memory technology and high frequency for groundbreaking computing and graphics performance. It also boasts numerous high-speed I/O interfaces, including PCIe Gen4 (16GT/s), USB 3.2 Gen2 (10Gbps), and 2.5Gbase-T, to enhance system expandability. With an optional NVMe SSD design and on-board TPM 2.0, an operating temperature range of -40~85°C, and a power input of 8.5~20V, the SOM-5883 is more reliable and offers greater security for edge computing requirements.
Groundbreaking Performance: 11th Gen Intel Processors and QFCS.
Equipped with 11th Gen Intel processors, the SOM-5883 is the first COM Express Type 6 module to support up to 8 cores and 128GB of DDR4 memory. The SOM-5883 delivers a 1.7x processing boost and a 1.5x 3D graphics improvement. Advantech provides the Edge AI Suite, which includes Intel Open VINO and over 100 AI models to help customers quickly find the right SKU for optimal AI development performance. The SOM-5883 supports four independent displays up to 4K resolution via three optional DisplayPort 1.4/HDMI 2.1, eDP, or LVDS ports, and VGA, and is configurable with up to two 8K HDR output ports.
Furthermore, this product boasts excellent energy efficiency, ensuring exceptional processing power while maintaining the same 45-watt CPU TDP as previous generations, making it an ideal upgrade for existing systems. Featuring Advantech's exclusive QFCS (Quadra Flow Cooling System) thermal technology, the SOM-5883 can unleash 100% of the CPU's power and deliver optimal performance. The thermal solution's design is not only efficient at dissipating heat but also slim, quiet, and lightweight, allowing customers to easily integrate it into a thin 1U chassis.
Next-Generation I/O Interface: x16 PCIe Gen4, 2.5GbE with TSN, and USB4.
The SOM-5883 is the first COM Express Type 6 module to offer x16 PCIe Gen4, doubling its bandwidth to 16 GT/s and enabling a throughput of 31.5 GB/s across 16 PCIe lanes. This allows graphics-based applications, such as ultrasound, to achieve significantly more accurate diagnoses thanks to the combination of the native graphics engine and external expansion for system configuration. Simultaneously, the SOM-5883 supports multiple next-generation I/O technologies. It enables high-speed data transmission with enhanced 2.5G LAN bandwidth and an onboard NVMe SSD, capable of transferring large volumes of data between AIoT applications. The 2.5G LAN connectivity, equipped with Time Sensitive Networking (TSN), is ideal for automation or edge applications requiring low latency. This technology meets real-time traffic demands by prioritizing critical data in the communication process, such as the timely transfer of commands, actions, or security information. It also features USB4, which can be configured as DisplayPort, Thunderbolt, USB 3.2, and USB 2.0 in a slim USB Type-C connector. Advantech also offers reference design documents for USB4 and the SOM-MZ10 development board to help developers accelerate the implementation of this new I/O technology.
Reliable Design and Easy Management for Edge Computing.
In addition to its excellent performance, the new SOM-5883 features an optimized design to suit a variety of applications. It boasts ECC memory, error correction, an integrated TPM2.0 chip to prevent cyber threats, an 8.5-20V power input range, and an operating temperature range of -40°C to 85°C. The soldered NVMe SSD design makes it more robust and vibration-resistant when operating in harsh environments, especially in edge computing applications. Beyond the hardware, the SOM-5883 also supports BIOS storage protection, secure boot, and BIOS power management. Furthermore, WISE-DeviceOn provides remote hardware monitoring and over-the-air (OTA) software updates to prevent system malfunctions.
Main features
- COM Express R3.0 Basic Type 6 Module
- 11th Generation Intel® Xeon and Core™ i7/i5/i3/Celeron™ Processors
- Up to 128GB DDR4 3200MT/s with ECC support
- Four independent displays with 3x DDI, eDP/LVDS, or VGA
- 1 PCIe x16 Gen 4, 8 PCIe Gen 3, 4 USB 3.2 Gen 2, 2.5G LAN with TSN, 2 SATA3 ports
- Supports Advantech iManager, Edge-AI Suite, and WISE-DeviceOn
- Operating Temperature: Standard: 0 ~ 60 °C (32 ~ 140 °F), Extended: -40 ~ 85 °C (-40 ~ 185 °F)
