The DDR4 memory in the conga-TS170 modules provides up to twice the system memory performance for data-intensive applications, while consuming 20 percent less power and requiring only half the footprint of DDR3 RAM, which is expected to become a legacy feature for future applications. In addition, the modules offer faster processor speeds, a 60 percent faster system bus, and expanded Intel® Smart Cache (up to 8 MB), as well as PCIe Gen 3.0 support for all PCIe lanes and the new Intel® HD Graphics P530. Overall, users can expect to benefit from improved system performance and envelope density, with lower space and power requirements.
The new modules have been developed for embedded server-level designs, operating within a TDP range of 25–45 W and requiring customized I/O and IoT interfaces. The new conga-TS170 modules, equipped with Intel Core processors, are suitable for applications including test and measurement equipment, back-end systems for medical image visualization, high-performance industrial workstations, and smart vending machines.
The Intel® Xeon® module variants also provide ECC memory protection, expanding their use to mission-critical data server and gateway applications. These applications can be found in industrial IoT and cloud servers, with big data analytics, carrier-grade edge node servers, and Industry 4.0 connectivity automation servers hosting multiple virtual machines or media servers with multi-stream real-time video transcoding
Furthermore, the new conga-TS170 modules offer powerful tools for managing distributed IoT, M2M, and Industry 4.0 applications. Thanks to Intel® vPro technology and the congatec board management controller with monitoring timer and power loss control, the modules are fully equipped for remote control, management and maintenance tasks, and even out-of-band management.
For cost-sensitive applications that do not necessarily require complex out-of-band or virtualization management, modules based on the Intel® Core™ i3 processor and the Intel® HM170 chipset are also available.
Detailed Features:
The new conga-TS170 modules are equipped with the latest processors, the 6th generation v5 14nm Xeon® and Intel® Core™. They feature a TDP of 25-45W, up to 8MB of smart cache, and up to 32GB of super-fast 2133 DDR4 memory, implemented as ECC memory for security-critical applications in the Intel® Xeon variants. For efficient 24/7 power consumption, the new modules support Disconnected Standby mode instead of the legacy S3 mode. With Disconnected Standby mode, switching from power-saving sleep mode to full performance mode takes less than half a second; as a result, systems can enter sleep mode more frequently without impacting usability or responsiveness.
The integrated 9th generation Intel® HD Graphics 530 supports DirectX 12 for faster 3D graphics on Windows 10, up to three independent 4K (3840 x 1260) displays via HDMI 1.4, DVI, or DisplayPort 1.2. For legacy applications, a dual-channel LVDS output and optional VGA output are available. With hardware support for HEVC, VP8, VP9, and VDENC decoding and encoding, it is now possible to transmit energy-efficient high-definition video in both directions.
In addition to PCI Express Gen 3.0 (PEG) graphics, the choice of available I/O interfaces includes eight PCI Express Gen 3.0 lanes, four USB ports, eight USB 2.0 ports, LPC, and I²C. SSD, HDD, and Blu-ray mass storage devices can be connected via four SATA 3.0 ports, including support for RAID 0, 1, 5, and 10. All Linux and Microsoft Windows operating systems are supported, including Windows 10. A comprehensive suite of add-ons, such as cooling solutions, mounting plates, and starter kits, completes the package to facilitate system design.
