The GPU in the new SoC module offers 128 MB of eDRAM, and with 72 execution units, it has three times the parallel processing power of the Skylake architecture without Iris graphics. Developers of tightly packed COM Express-based system designs now have access to a new class of performance that previously required a dedicated graphics unit.

Thanks to their outstanding performance, the new conga-TS170 CoMs will be in high demand for high-performance image processing applications in industrial and medical technology, as well as in industrial-grade IoT node servers and multimedia servers with virtualization. Examples include GPGPU-based video encoding, deep packet inspection, and big data analysis. Other application areas include small industrial client servers with VDI virtual desktop infrastructure. To manage these IoT, M2M, and Industry 4.0 applications, the new conga-TS170 module also offers powerful server-type tools. Thanks to Intel® vPro technology and the Congatec board management controller with watchdog timer and power loss control, the module is fully equipped for remote control, management and maintenance tasks, and even out-of-band management.

The detailed feature set:
The conga-TS170 module features the latest 14nm Intel® Xeon® E3-1515M v4 processor. It supports up to 32GB of super-fast SO-DIMM DDR4-2133 ECC memory for data-sensitive server applications. The integrated Intel® Gen9 Iris™ Pro graphics provide 72 execution units with a maximum clock speed of 1150 MHz. For parallel computing tasks, it supports OpenCL 2.0 and DirectX 12, as well as OpenGL 4.4 for high-performance 3D graphics, on up to three independent 4K (3840 x 2160) displays via HDMI 1.4 and DisplayPort 1.2. For legacy applications, a dual-channel LVDS output and VGA output are available. It also supports hardware-accelerated encoding and decoding of HEVC, VP8, VP9, ​​and VDENC video.

In addition to PCI Express Gen 3.0 (PEG) graphics, the choice of available I/O interfaces includes 8x PCI Express Gen 3.0, 4x USB 3.0, 8x USB 2.0, LPC, and I²C. SSDs and other non-volatile mass storage can be connected via 4x SATA 3.0, including support for RAID 0, 1, 5, and 10. It is compatible with major Linux and Microsoft Windows operating systems, including Windows 10. A comprehensive suite of add-ons, such as cooling solutions, carrier boards, and starter kits, completes the offering to facilitate design.

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